Stats Chippac Pte. Ltd.

Bongsuk Choi

Il Kwon Shim

Koo Hong Lee

Oh Han Kim

Jae Han Chung

Young Cheol Kim

BaeYong Kim

Keon Teak Kang

An electronic system is provided including forming a substrate having a contact, forming a conductive structure over the contact, mounting an electrical device having an external interconnect over the conductive structure, and forming a conductive protrusion from the conductive structure in the external interconnect.

Electronic system with vertical intermetallic compound

A wafer level chip scale package system is provided including placing a first integrated circuit over a semiconductor wafer having a second integrated circuit; connecting a second electrical interconnect between the first integrated circuit and the second integrated circuit; forming a stress relieving encapsulant on the outer perimeter of the second integrated circuit for covering the second electrical interconnect; and singulating a chip scale package, from the semiconductor wafer, through the stress relieving encapsulant and the semiconductor wafer.

Wafer level chip scale package system

A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.

Stacked integrated circuits package system with dense routability and high thermal conductivity

Growing community of inventors

Kyoungki-do, South Korea

Bongsuk Choi