Samsung Electronics Co., Ltd.

Bongsu Cho

Sangil Choi

Heeseok Nho

Sungjoon Joo

Jwahyeon Kim

Seonggi Jeon

Kyungho Ha

A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.

Substrate processing apparatus having chamber cover

A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9&#xb0; to 5&#xb0; with respect to the first surface at the edge of the body.

Substrate transfer apparatus and substrate transfer system using the same

Growing community of inventors

Asan-si, South Korea

Bongsu Cho