Korea Institute of Machinery & Materials

Center for Advanced Meta-materials

Bongkyun Jang

Jae-Hyun Kim

Kwangseop Kim

Hak Joo Lee

Byung-Ik Choi

Seung-Mo Lee

Yun Hwangbo

Sejeong Won

Hak-Joo Lee

Sang Min Kim

Kyung-Sik Kim

Kwang-Seop Kim

Chang Hyun Kim

Chan Soo Kim

Jung Yup Kim

Hyun June Jung

Yeon Woo Jeong

Jaegu Kim

Hyung Cheoul Shim

Seong Min Hong

Minwoo Kweun

Ah Hyun Park

Soyeon Park

Hyeon-Don Kim

Bongsung Kim

Sung Uk Yoon

Hyun-Sung Park

An embodiment of the present invention provides a stretchable substrate that may be significantly stretchable to be deformed but have a low rate of breakage. Here, the stretchable substrate includes a cell, a cut portion, and an extended cut line. A plurality of cells are formed in the substrate body, and a device is mounted thereon. The cut portion is formed in the substrate body to increase a distance between the cells when the substrate body is stretched. The extended cutting line is formed to extend from an end portion of the cut portion and bent inwardly of the cell so that corners of the cells are rounded.

Stretchable substrate

A method for fabricating a nano-particle includes preparing a nano-particle dispersion including a nano-particle having a perovskite structure with a first ligand on a surface thereof and a non-polar solvent; and mixing a silane compound, a halogen compound and the nano-particle dispersion to substitute a silane ligand for the first ligand.

Method for fabricating nano-particle having perovskite crystalline structure and resin composition including the nano-particle

An embodiment of the present invention provides an element transferring method that may increase a yield of transferring an element, and an electronic panel manufacturing method using the same. The element transferring method includes: preparing a carrier film in which a first surface of an element on which a terminal is formed is adhered to an adhesive surface; providing a cover adhesive layer on the adhesive surface so that the second surface of the element that is opposite to the first surface and where the terminal is not formed is covered; transferring the element to the target substrate by adhering the cover adhesive layer to the target substrate while the second surface is facing the target substrate; and separating the carrier film from the element, wherein in transferring the element, the carrier film is pressed so that the surface of the cover adhesive layer is flat at the same height as the terminal.

Element transferring method and electronic panel manufacturing method using the same

A stretchable substrate includes a cell and an electrode wiring. The cell is divided by cutting lines to form a plurality of cells. The electrode wiring is continuously provided on the plurality of cells not to cross the cutting line. A cell is connected to a neighboring cell by a connection portion in which a cutting line is not formed, and when a tensile force is applied, the cell is hinge-rotated around the connection portion, and the electrode wiring maintains a continuous state even when the cell is hinged.

Stretchable substrate and method of controlling device spacing using the same

A method for transferring a micro device on a curved surface according to an exemplary embodiment of the present invention includes: coating an adhesive layer on an external circumferential surface of a tube; providing a micro device pattern on one side of a substrate; positioning an external circumferential surface of the tube to contact the substrate and allow a length direction of the device pattern to cross a radius direction of the tube, and rotating the tube with respect to an axis-direction of the tube and simultaneously moving at least one of the tube and the substrate in a rectilinear way to transfer the micro device pattern on the substrate to the adhesive layer; and fixing the transferred micro device pattern to the adhesive layer by curing the adhesive layer.

Method for transferring micro device on curved surface and apparatus for transferring micro device on curved surface

A film transferring method according to an embodiment of the present invention of transferring a film adhered to a substrate to a roller in a state that a first adhesion force between the roller and the film and a second adhesion force between the film and the substrate are substantially the same includes: a transporting step of transporting the substrate and the film of which a first adhesion surface formed on one surface is adhered to the substrate in a first direction; a close contacting step of closely contacting the front end of the second adhesion surface formed on the other surface of the film that is transported with the roller rotating in the first rotation direction; and a transferring step of peeling the film from the substrate and simultaneously transferring it to the roller by peeling the front adhesion surface of the first adhesion surface from the substrate, while simultaneously transferring the front end of the second adhesion surface to the roller and continuously transporting the substrate in the first direction, wherein a first weak adhesion force that is smaller than the second adhesion force is formed between the front adhesion surface and the substrate.

Method of transferring film

An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.

Method and apparatus for transferring micro device, and electronic product using the same

A carrier film according to an embodiment of the present invention comprises: a base film; and a first adhesive layer formed on a surface of the base film such that an element to be transferred is attached to the first adhesive layer, wherein the magnitude of force of adhesion between the element and the first adhesive layer is in proportion to the depth of press-fitting at which the element is press-fitted into the first adhesive layer.

Carrier film, element transfer method using same, and electronic product manufacturing method using element transfer method

A selective transfer roll stamp is provided which rotates on a source substrate to selectively transfer elements arranged on the source substrate. The selective transfer roller stamp includes: a roller unit rotating about an axis of rotation and including projecting portions protruding in a radial direction and recessed portions formed between neighboring projecting portions; and an adhesive layer formed on the outer circumferential surface of the roller unit and coming into contact with the elements, wherein the outer circumferential surface of the adhesive layer is made flat in a circumferential direction.

Selective transfer roll stamp

A selective continuous transferring apparatus includes a roll and a sticking layer. The roll has an elastic surface, and contacts a source substrate with a receiving substrate to transfer elements on the source substrate to a lower surface of the receiving substrate. A plurality of the elements is arranged on an upper surface of the source substrate. The sticking layer has a predetermined pattern in a partial area of the lower surface of the receiving substrate. The elements are attached to the sticking layer. The roll pressurizes a series of stacked layer of the source substrate, the elements and the receiving substrate, so that the elements disposed corresponding to the sticking layer of the receiving substrate are partially and selectively transferred on the receiving substrate.

Selective continuous transferring apparatus based on adhesion-controlled film

In an apparatus and a method for synchronizing a roll-to-roll transfer device, the apparatus includes a thin-film, a first roller, a second roller, a first load sensing element and a control part. The thin-film is transferred by the roll-to-roll transfer device. The first roller makes contact with a lower surface of the thin-film, and rotates with a rotational axis via a first rotational element. The second roller is disposed over the first roller, makes contact with an upper surface of the thin-film, and rotates with the rotational axis via a second rotational element. The first load sensing element senses a load of the first roller or a load of the second roller. The control part synchronizes a translational velocity of the first rotational element or the second rotational element based on the load sensed by the first load sensing element.

Growing community of inventors

Daejeon, South Korea

Bongkyun Jang