Samsung Electronics Co., Ltd.

Bongchoon Park

Jinyong Park

Taewoo Kim

Sangyong Kim

Sanghoon Park

Hyeongju Lee

Bongkyu Min

Hyelim Yun

Younoh Chi

Taewon Sun

Dui Kang

Bosung Choi

An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

Board having conductive layer for shielding electronic component and electronic device including the same

An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.

Electronic device including interposer

Growing community of inventors

Gyeonggi-do, South Korea

Bongchoon Park