Samsung Electronics Co., Ltd.

Bongchan Kim

Kwangseok Byon

Hyungjin Rho

Jaeheung Park

Kihuk Lee

Hwajoong Jung

Taehwan Kim

Hanseok Kim

Jonghoon Won

Hyosang An

Byoungha Yi

Jisun Yoon

Intaek Lee

Donghoon Kim

Jaehyoung Park

Hwayong Kang

Jonghun Won

TaeHwan Kim

Min Heu

Byeonghoon Park

Young-Ja Kim

Woontahk Sung

Jongsun Kim

Songha Choi

A camera module and an electronic device including the same are provided. The camera module and an electronic device include a camera housing, a barrel structure including at least one lens aligned along a first optical axis direction, the barrel structure being at least partially accommodated in the camera housing, a guide unit configured to guide the barrel structure to reciprocate along the first optical axis direction or reciprocate in a plane intersecting the first optical axis, a driving unit axis, a reflective member configured to refract or reflect light incident through the at least one lens in a second optical axis direction intersecting the first optical axis, and an image sensor disposed on the camera housing, aligned with the reflective member in the second optical axis direction, and configured to receive the light refracted or reflected by the reflective member.

Camera module and electronic device including the same

Disclosed is a camera module. The camera module includes a lens assembly including a lens and an image stabilization assembly including a moving member including a first substrate and an image sensor electrically connected to the first substrate, the image stabilization assembly being connected to the lens assembly wherein an optical axis is at least partially aligned with the image sensor. The image stabilization assembly is configured to move the moving member in at least one direction perpendicular to the optical axis such that the optical axis is aligned with a specified position on the image sensor.

Camera module including image stabilization assembly and electronic device including the camera module

A camera module according an embodiment includes: a lens assembly, an image sensor, an optical image stabilization (OIS) carrier configured to simultaneously rotate the lens assembly and the image sensor based on an axis perpendicular to an optical axis, a housing, a first OIS coil disposed to a first side surface of the OIS carrier, a second OIS coil disposed to a second side surface of the OIS carrier, a first OIS magnet disposed to face the first OIS coil, a second OIS magnet disposed to face the second OIS coil, a frame including a first portion disposed between the third side surface of the OIS carrier opposite the first side surface and the housing and including at least one first guide portion, and a second portion extending from the first portion and disposed between the fourth side surface of the OIS carrier opposite the second side surface and the housing, at least one first object disposed between the first portion and the third side surface, and at least one second object disposed between the second portion and the housing. The at least one first object may be configured to roll along the at least one first guide portion based on the OIS carrier rotating.

An electronic device including a camera module is provided. The camera module includes a lens assembly including a lens, a lens holder in which the lens assembly is fixedly disposed, a sensor carrier that includes an image sensor at least partially aligned with an optical axis of the lens and a circuit board electrically connected with the image sensor and that moves in a first axial direction perpendicular to the optical axis and a second axial direction perpendicular to the optical axis and the first axial direction, a fixed substrate adjacent to the sensor carrier and fixed in a specified position, and a connecting member that extends from the circuit board to the fixed substrate and that extends to surround at least three interconnected edges of the circuit board when viewed in a direction of the optical axis.

Camera having movable image sensor and electronic device including the same

An electronic device according to an embodiment of the disclosure includes: a housing and a camera module, at least part of which is disposed in the housing. The camera module includes a camera housing, a sensor assembly including an image sensor and is fixed to the camera housing, and a lens unit, at least part of which is accommodated in a space formed by the camera housing and the sensor assembly, the lens unit being configured such that all or part of the lens unit moves relative to the camera housing and the sensor assembly. The lens unit includes a lens assembly including a lens, a first carrier to which the lens assembly is coupled, a second carrier in which the first carrier is accommodated to be movable in a direction perpendicular to an optical axis of the lens, a stopper coupled to the second carrier to cover at least part of the first carrier, and a first damper, at least part of which is disposed between the stopper and the first carrier.

Disclosed is an electronic device including a camera module enabling a movable member (e.g., a circuit board) having an image sensor disposed thereon to move for an image stabilization function and including a connecting member that provides electrical connection of the image sensor, and an electronic device including the camera module.

According to various embodiments, an electronic device may include a first light emitter comprising first light emitting circuitry configured to output light of a first wave bandwidth, a second light emitter comprising second light emitting circuitry configured to output light of a second wave bandwidth, a camera including an image sensor configured to arrange one or more first pixels for sensing the light corresponding to the first wave bandwidth and the second wave bandwidth and one or more second pixels for sensing the light corresponding to the second wave bandwidth, and a processor. The processor may be configured to control the electronic device to output the first wave bandwidth light using a first light source and the second wave bandwidth light using a second light source, and a control circuit electrically coupled to the image sensor and connected to an application processor through a designated interface. The control circuit may be configured to obtain image data of an external object using the camera from the first wave bandwidth light and the second wave bandwidth light reflected from the external object, to generate first image data of the external object using a difference between first pixel data corresponding to the one or more first pixels and second pixel data corresponding to the one or more second pixels of the image data, to generate second image data of the external object by binning the second pixel data corresponding to the one or more second pixels of the image data, and to transmit the first image data and the second image data to the processor through the designated interface, wherein the processor is configured to generate authentication information based on the first image data and to generate depth information using the second image data.

Method for generating plural information using camera to sense plural wave bandwidth and apparatus thereof

In embodiments, an electronic device may include a first camera disposed on one surface of the electronic device, a second camera disposed on the one surface, a depth sensor disposed on the one surface, and a processor configured to: cause the first camera to acquire a first one or more images of an external object, and generate depth information of the external object using a selected one of the first camera and second camera or the depth sensor, the selected one based on color information or texture pattern information corresponding to the external object in the first one or more images.

Electronic device and method for acquiring depth information by using at least one of cameras or depth sensor

A method and device for real time transmission power control in a wireless communication system are provided. The method includes receiving transmission power control related information from at least one base station, generating transmission power control information for load balancing of the at least one base station based on the transmission power control related information, and controlling the transmission power of the at least one base station based on the transmission power control information.

Method and device for real time transmission power control in wireless communication system

Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches.

Growing community of inventors

Suwon-si, South Korea

Bongchan Kim