Samsung Electronics Co., Ltd.

Bong-Yong Lee

Tae-Hyun Yoon

Kyung-Jun Shin

Hae-Bum Lee

Jung-Ro Ahn

Dong-Chan Kim

Tae-hun Kim

Su-Jin Ahn

Kwang-Soo Kim

Sang-Eun Lee

Chang-Min Choi

Eui-Do Kim

Min-kyung Bae

Heon-Kyu Lee

Sang-Youl Kwon

Jung-In Han

Myung-Hun Woo

Houng-Kuk Jang

A method of programming a non-volatile memory includes executing at least two program loops on memory cells in a selected word line, generating a fail bit trend based on a result of executing each of the at least two program loops, predicting a plurality of program loops comprising an N program loop to be executed last on the memory cells, based on the generated fail bit trend, and changing, based on a result of predicting the plurality of program loops, a level of an N program voltage provided to the memory cells when the N program loop is executed.

Non-volatile memory device and program method of a non-volatile memory device

A vertical semiconductor device includes a plurality of channel connection patterns, a lower insulation layer, a supporting layer, a stacked structure, and a channel structure. The channel connection patterns, on which the lower insulation layer is formed, contact a substrate. The supporting layer is formed on the lower insulation layer to be spaced apart from the channel connection patterns, and includes polysilicon doped with impurities. The stacked structure is formed on the supporting layer, and includes insulation layers and gate electrodes to form a memory cell string. The channel structure passes through the stacked structure, the supporting layer and the lower insulation layer, and includes a charge storage structure and a channel which contacts the channel connection patterns. The charge storage structure and the channel face the gate electrodes and the supporting layer. The supporting layer serves as a gate of a gate induced drain leakage (GIDL) transistor.

Vertical semiconductor devices

In a non-volatile memory system, a plurality of main memory cells for storing data is arranged in a data cell array and a plurality of reference memory cells is arranged in a reference cell array. The reference cell array includes first reference word lines connected to first reference memory cells and extending, second reference word lines connected to second reference memory cells and extending alternately with the first reference word lines, reference bit lines to which the first and the second reference memory cells are alternately connected in a line and a combined cell having a pair of the first and second reference memory cells and generating a reference signal for processing the data. The first and the second reference memory cells have different cell characteristics. The stability of the reference signal is improved irrespective of the differentiation of the first and the second reference memory cells.

Non-volatile memory systems having at least one pair of memory cells

In a method of storing data in a nonvolatile memory device, a program operation is performed on target memory cells among a plurality of memory cells based on a program voltage. A verification operation is performed on the target memory cells based on a verification voltage to determine whether all of the target memory cells are completely programmed. The verification voltage is changed depending on the program operation.

Method of storing data in nonvolatile memory device and method of operating nonvolatile memory device

A semiconductor memory device includes a main cell array region, a first redundancy cell array region and a first dummy cell array region that are formed at one side of the main cell array region, and a second redundancy cell array region and a second dummy cell array region that are formed at the other side of the main cell array region. The first redundancy cell array region includes a first redundancy bitline, and the first dummy cell array region includes first dummy bitlines. The second redundancy cell array region includes a second redundancy bitline, and the second dummy cell array region includes second dummy bitlines. The first and second redundancy cell array regions are disposed closer to the main cell array region than the first and second dummy cell array regions.

Semiconductor memory device and method for repairing the same

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Suwon-si, South Korea

Bong-Yong Lee