Cheil Industries Inc.

Bong Yong Kim

Kyoung Soo Park

Hyun Hee Namkung

Hyun Joo Seo

Kang Bae Yoon

Sang Sik Bae

Woo Jin Lee

Dong Seon Uh

Jin Kyu Kim

Jin Seong Park

Youn Jo Ko

Woo Jun Lim

Jang Hyun Cho

Cheon Seok Lee

Kyung Jin Lee

Byeong Hwan Jeon

Young Jin Kwon

Kyong Hun Shin

An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160&#xb0; C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1.

Electronic device

A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Composition for circuit connection film and circuit connection film using the same

An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

Adhesive composition and anisotropic conductive film using the same

Growing community of inventors

Uiwang-si, South Korea

Bong Yong Kim