Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Bong Sup Lim

Sang Soo Park

Young Ghyu Ahn

Jin Ho Kim

Sung Jin Park

Dong Seok Park

Hyun Jun Jung

Ji-Won Lee

Ji-won Lee

Ho Yeon Kim

Seok Bong Baek

Woo-Seok Oh

Yong Ki Cho

Jong Soo Jeong

Yun Jin Jung

Young Sun Park

Byoung Oh Park

Disclosed herein is a display apparatus packing material. The display apparatus packing material includes a first area configured to cover a front surface of a display apparatus; a second area configured to cover sides of the display apparatus, and extending from edges of the first area; and a third area disposed between the first area and the second area such that the second area is bendable with respect to the first area, wherein the second area covers sides of the display apparatus when the second area is bent, and includes an adhesive member configured to be attached on the sides of the display apparatus.

Packing materials for display apparatus and packing method for display apparatus

A coil component includes a body part in which a plurality of body sheets are stacked, an internal coil disposed in the body part and including a plurality of internal electrode patterns each disposed on a respective one of the plurality of body sheets, and an external electrode part electrically connected to both ends of the internal coil. A first internal area of a first internal electrode pattern disposed on one of the plurality of body sheets is smaller than a second internal area of a second internal electrode pattern disposed on another of the plurality of body sheets.

Coil component

A packaging box is formed of corrugated cardboard, wherein end portions of the packaging box are protruded relative to a middle portion of the packaging box so that the packaging box has a curved shape, and a corrugation direction of the corrugated cardboard is parallel to a longitudinal direction of the packaging box.

Corrugated packaging box

According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.

Automatic packing apparatus and automatic packing method using the same

A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.

Coupling structure for multi-layered chip filter, and multi-layered chip filter with the structure

A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member.

Package member for flat panel display apparatus

Growing community of inventors

Suwon-si, South Korea

Bong Sup Lim