Wisol Co., Ltd.

Bong Soo Kim

Jae Hyung Choi

Yo Sep Choi

Jung Hoon Han

Jun Woo Yong

Eun Tae Park

The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

Surface acoustic wave device package and method of manufacturing the same

A button device includes a piezoelectric element which includes a piezoelectric body with one surface on which a first external electrode and a second external electrode are formed and a plate with one surface attached to the other surface of the piezoelectric body, a supporting plate disposed on the one surface of the piezoelectric body, a cover disposed on the other surface of the plate, a first spacer provided between an edge portion of the one surface of the plate and the supporting plate, a second spacer provided between at least a part of an edge portion of the other surface of the plate and the cover to provide a separation space between the plate and the cover, and a dot provided in the separation space to transfer an external force to the piezoelectric element or to transfer a vibration of the piezoelectric element to the cover.

Growing community of inventors

Osan-si, South Korea

Bong Soo Kim