Lg Innotek Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Bong Kul Min

Gyu Hyeong Bak

Chang Man Lim

Hyoung Jin Kim

Won Jung Kim

Ho Young Chung

Sung Joo Oh

Dong Hyun Yu

Song Eun Lee

Ji Wook Moon

Ki Bum Kim

Jin Seong Kim

Kyung Ho Shin

Yeo Chan Yoon

Won Jin Son

Jae Hwan Jung

Hui Seong Kang

Yeong June Lee

Dae Geun Kim

Deung Kwan Kim

Gam Gon Kim

Seul Ki Kim

Byeong Duck Lee

Heung Ju Lee

Won Bong Lee

Byeong Hwang Min

Kyoung Un Kim

Chung Hee Ryu

Muyng Gi Kim

An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.

Light emitting device package and lighting apparatus having same

A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.

Light-emitting device package

A light emitting device package is disclosed. The light emitting device package includes a body, first and second reflection cups spaced apart from each other in a top surface of the body, a first connection pad disposed in the top surface of the body, spaced apart from the first and second reflection cups, a first light emitting diode mounted in the first reflection cup, a second light emitting diode mounted in the second reflection cup, and a partition wall disposed between the first reflection cup and the second reflection cup, the partition wall extended from the top surface of the body upwardly.

Light emitting device and display device including the same

A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.

Light-emitting element package having lead frame with connection portion

A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.

Light emitting device package and light emitting apparatus

A light-emitting device package according to an embodiment provides a light-emitting device including a light-emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; first and second lead frames disposed in the package body and disposed to be electrically isolated from each other; a first solder portion of a solid state disposed between the first lead frame and the first conductive semiconductor layer, the first solder portion having a uniform area and an even thickness; and a second solder portion of a solid state disposed between the second lead frame and the second conductive semiconductor layer, the second solder portion having a uniform area and an even thickness.

Light-emitting device package and light-emitting apparatus comprising same

A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

Light emitting device package

A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.

An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.

An embodiment provides a phosphor composition and a light emitting device package comprising the same, wherein the phosphor composition comprises green phosphor, amber phosphor, and red phosphor, wherein the amber phosphor is expressed as chemical formula LiSiAlON:Eu, where 2&#x2264;m&#x2264;5, 2&#x2264;n&#x2264;10, 0.01&#x2264;X&#x2264;1. The light emitting element package of the embodiment can display white light having improved brightness and color rendering index.

Phosphor composition, light emitting element package comprising same, and lighting system

Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.

Light emitting device and lighting apparatus having the same

A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second lead frame spaced apart from the frame, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices on the frame exposed through the first cavity. The body may include a reflective part provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency.

Growing community of inventors

Seoul, South Korea

Bong Kul Min