Koh Young Technology Inc.

Kyungpook National University Industry-academic Cooperation Foundation

Bong-Ha Hwang

Seung-Jun Lee

Min-young Kim

Yu-Jin Lee

Joong-Ki Jeong

Hee-Tae Kim

Soo-Young Cho

Hee-Wook You

Kwang-Ill Kho

A method of inspecting a substrate is disclosed. The method is performed by a substrate-inspecting apparatus having at least one projecting module projecting a patterned light onto a substrate fixed on a stage and an inspecting module with a camera capturing an image, and inspecting a plurality of inspection regions of the substrate step by step. The method comprises, setting an inspection order of the inspecting regions according to a lengthwise direction of the substrate, estimating height displacement of a target inspection region by using a tendency information regarding at least one previous inspection region that is already inspected, adjusting height of the inspecting module by using the estimated height displacement of the target inspection region, and inspecting the target inspection region by using the inspecting module of which height is adjusted. Therefore, inspection time is reduced.

Method of inspecting a substrate

In order to inspect a board, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a conversion condition is established for the measurement area, and a conversion relation is acquired according to a distortion degree between reference data and measurement data. Thereafter, validity of the conversion relation is verified by using at least one of verifying that a comparison feature object satisfies the conversion relation, verifying that a verification feature object selected from feature objects satisfies the conversion relation and verifying that a pad formed on the board satisfies the conversion relation. Then, the conversion condition is confirmed, and an inspection area for inspecting a measurement target is set according to the confirmed conversion condition. Thus, an inspection area may be correctly set so that distortion is compensated for.

Inspection method

An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

Board inspection apparatus and method

In order to measure a three-dimensional shape, feature information is read from a database. A board is transferred to a measurement position. A measurement head is transferred to an inspection area of the board. Light of a first lighting device for three-dimensional measurement and light of a second lighting device for two-dimensional measurement is illuminated onto the inspection area to photograph a first reflection image and a second reflection image that are reflected from the inspection area. The inspection area is realigned by comparing the feature information with at least one of the photographed first and second reflection images to inspect distortion of the inspection area. The realigned inspection area is inspected. Thus, the three-dimensional shape may be precisely measured.

Method of measuring a three-dimensional shape

In order to inspect a board, firstly, a measurement area is set on a board, and reference data and measurement data of the measurement area are acquired. Then, a plurality of feature blocks is established by a block unit so as to include a predetermined shape in the measurement area, and a merged block is established by merging feature blocks overlapped in the feature blocks. Thereafter, a distortion degree is acquired by comparing reference data and measurement data corresponding to a feature block except for the merged block and/or the merged block, and the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, an inspection area, in which distortion is compensated for, may be correctly set.

In order to set an inspection area in an inspection apparatus for inspecting a board, a plurality of measurement areas are set on a board, and then reference data and measurement data of at least one adjacent measurement area that is adjacent to a target measurement area for inspecting a measurement target, among the measurement areas, are acquired. Thereafter, at least one feature object is extracted from the adjacent measurement area. Then, a distortion degree is acquired by comparing reference data and measurement data corresponding to the feature object with each other, and thereafter the distortion degree is compensated for, to set an inspection area in the target measurement area. Thus, a conversion relation between the reference data and the measurement data may be correctly acquired, and an inspection area, in which distortion is compensated for, may be correctly set.

In order to set an inspection area, a measurement target is disposed onto a stage, a reference data of the measurement target is summoned, and a measurement data of the measurement target is acquired. Then, at least one feature object is selected in the measurement data and the reference data of the measurement target, and at least one feature variable for the selected feature object is extracted from each of the reference data and the measurement data. Thereafter, a change amount of the measurement target is produced by using the feature variable and a quantified conversion formula, and the produced change amount is compensated for to set an inspection area. Thus, the distortion of the measurement target is compensated for to correctly set an inspection area.

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Seoul, South Korea

Bong-Ha Hwang