Samsung Electronics Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Samsung Fine Chemicals Co., Ltd.

Shenzhen Wote Advanced Materials Co., Ltd.

Bon Hyeok Gu

Myung Sup Jung

Chung Kun Cho

Mahn Jong Kim

Yoo Seong Yang

Mi Jeong Kim

Sang Hyuk Suh

Yang Seob Kim

Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes 5-25 parts by mole of a repeating unit (A) derived from an aromatic hydroxy carboxylic acid; 20-40 parts by mole of at least one repeating unit selected from the group consisting of a repeating unit (B) derived from an aromatic amine having a phenolic hydroxyl group and a repeating unit (B') derived from an aromatic diamine; 20-40 parts by mole of a repeating unit (C) derived from an aromatic dicarboxylic acid; 5-20 parts by mole of a repeating unit (D) derived from an aromatic diol; and 5-20 parts by mole of a repeating unit (E) derived from an aromatic amino carboxylic acid.

Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad laminate

A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.

Composition for producing printed circuit board and printed circuit board using the same

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Hwaseong-si, South Korea

Bon Hyeok Gu