Micron Technology Incorporated

Texas Instruments Corporation

Institute of Technical Education

Bok Leng Ser

Yong Poo Chia

Suan Jeung Boon

Siu Waf Low

Yong Loo Neo

Teck Kheng Lee

Wei Zhou

Meow Koon Eng

Kian Teng Eng

Min Yu Chan

Chee Kiang Yew

Sian Yong Khoo

Sui Waf Low

A multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device. The multilayer structure comprises: a substrate having an electrically conductive portion thereon; a dielectric layer formed over the substrate; the dielectric layer comprising an opening over at least part of the electrically conductive portion; and a conductive pillar formed on the at least part of the electrically conductive portion; wherein the conductive pillar comprises walls defined by at least the opening of the dielectric layer and an opening of a patterned layer.

Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device

A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

Packaged microelectronic components

A wafer level package, and a semiconductor wafer, an electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of memory packages such as single in line memory modules (SIMMs) or dual in line memory modules (DIMMs).

Super high-density module with integrated wafer level packages

A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more die packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of memory packages such as single in-line memory modules (SIMMs) or dual in-line memory modules.

A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.

Super high density module with integrated wafer level packages

A high density single inline memory module (140) comprising a printed circuit board (132) and at least one integrated circuit module (130) attached to the first side (134) of the printed circuit board (132), wherein the integrated circuit modules (130) each including first and second integrated circuit packages (30) stackably and electrically connected together is disclosed.

Growing community of inventors

Singapore, Singapore

Bok Leng Ser