Samsung Electro-mechanics Co., Ltd.

Bok Goo Heo

Sang Hyun Park

Kyoung Hoon Kim

Mi Jin Park

Kyung Pyo Hong

Sun Cheol Lee

Min Hyang Kim

Seung Yul Lee

Hyoung Wook Lim

A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.

Chip component

Growing community of inventors

Suwon-si, South Korea

Bok Goo Heo