Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Bojan Tesanovic

Hartmut Rudmann

Nicola Spring

Simon Gubser

Qichuan Yu

Ji Wang

Susanne Westenhöfer

Tobias Senn

Alexander Bietsch

Mario Cesana

Xu Yi

Jukka Alasirnio

Robert Lenart

Edmund Koon Tian Lua

Ming Jie Lee

Hongyuan Liu

Myo Paing

Jian Tang

Devanraj Kupusamy

Eunice Ho Hui Ong

Kam Wah Leong

Camilla Camarri

Susanne Westenhoefer

Sebastiano Lazzi Gazzini

Jukka ALASIRNIÖX

A method of manufacturing a plurality of optical elements () comprising the steps of providing a substrate (), and a tool () comprising a plurality of replication sections (), each defining a surface structure of one of the optical elements (), the tool () further comprising at least one contact spacer portion (), aligning the tool () and the substrate () with respect to each other and bringing the tool () and a first side of the substrate () together, with replication material () between the tool () and the substrate (), the contact spacer portion () contacting the first side of the substrate (), and thereby causing the spacer portion () to adhere to the first side of the substrate (), hardening the replication material (), wherein the substrate () has yard line features () around at least a portion of the replication sections (), the yard line features () containing the replication material () on a first side of the yard line with respect to the tool () and the substrate ().

Yard control features

This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

Optoelectronic modules having locking assemblies and methods for manufacturing the same

Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.

Optoelectronic modules having transparent substrates and method for manufacturing the same

Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

Molded circuit substrates

Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub&#xac;structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

Optical element stack assemblies

A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element () having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (), at least one optical structure ().

Method for manufacturing passive optical components, and devices comprising the same

The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same

Optoelectronic device subassemblies and methods of manufacturing the same

Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Growing community of inventors

Steinhausen, Switzerland

Bojan Tesanovic