Lumens Co., Ltd.

Bogyun Kim

Jugyeong Mun

Taekyung Yoo

Gunha Kim

Junhyung Lim

Minpyo Kim

Juok Seo

Hyunpyo Hong

Jihye Chang

Jeongwoo Lee

Youngkyo Ro

A flexible surface lighting device is disclosed. The flexible surface lighting device includes: a flexible substrate including an upper insulating film, a lower insulating film, and a thin metal layer interposed between the upper and lower insulating films; a plurality of micro-LED chips two-dimensionally arrayed on the top surface of the flexible substrate; and a flexible light-transmitting resin part disposed on the top surface of the flexible substrate to cover the top and side surfaces of the micro-LED chips. The flexible substrate includes a white reflective layer in contact with the light-transmitting resin part on the upper insulating film.

Flexible lighiing device and display panel using micro LED chips

Disclosed is an LED display panel including inner LED display modules and outer LED display modules. Each of the inner LED display modules and the outer LED display modules includes a first flexible circuit board and a second flexible circuit board arrayed in a row in the lengthwise direction and on which LEDs are arrayed, and an upper viscoelastic film and a lower viscoelastic film bonded to each other through the first flexible circuit board and the second flexible circuit board. Each of the first flexible circuit board and the second flexible circuit board includes a folded edge portion and an unfolded edge portion opposite to the folded edge portion. A controller unit is disposed under the folded edge portion to control the LEDs. The folded edge portion of the first flexible circuit board faces the folded edge portion of the second flexible circuit board in each of the inner LED display modules.

Flexible LED display with processor under a folded edge portion

A method for arraying micro-LED chips is disclosed. The method includes preparing a chip carrier formed with a plurality of chip pockets whose internal pressure is reduced through a plurality of suction holes, capturing the micro-LED chips in the corresponding chip pockets such that the micro-LED chips are in close contact with the bottoms of the chip pockets, and placing the micro-LED chips captured in the chip pockets on a base body. Each of the chip pockets includes a slope through which an inlet having a larger width than the bottom is connected to the bottom. The distances between the centers of the adjacent micro-LED chips placed on the base body are the same as those between the centers of the corresponding chip pockets.

Method for arraying micro-LED chips for manufacturing LED display panel and multi-chip carrier used in the method

Growing community of inventors

Yongin-si, South Korea

Bogyun Kim