Imec Vzw

Imec

Interuniversitair Microelektronica Centrum (imec)

Katholieke Universiteit Leuven

Interuniversitair Micorelektronica Centrum (imec, Vzw)

Bogdan Govoreanu

Eric Beyne

Maarten Rosmeulen

Pieter Blomme

Ruoyu Li

Fahd Ayyalil Mohiyaddin

Tom Schram

Stefan De Gendt

Steven Brebels

Sven Van Elshocht

Stefan Kubicek

George Eduard Simion

Hag-Ju Cho

Christoph Adelmann

Malgorzata Jurczak

HongYu Yu

Florin Ciubotaru

Jaber Derakhshandeh

Clement Godfrin

Iuliana Radu

Leqi Zhang

A qubit device includes first and second linear qubit arrays. Each qubit array includes a semiconductor substrate, control gates configured to define a single row of quantum dots along the substrate, and nanomagnets distributed along the row of quantum dots such that a nanomagnet is arranged at every other pair of quantum dots of the row of quantum dots. Each nanomagnet has an out-of-plane magnetization with respect to the substrate, where the rows of the first and second arrays extend in a common row direction and are separated along a direction transverse to the row direction. The qubit device further includes superconducting resonators connecting pairs of quantum dots between the first and second arrays. Each pair of quantum dots in the first array is configured to couple with a superconducting resonator of the first set to connect with a different pair of quantum dots of the second array.

Qubit device

An integrated system for quantum computation is provided, In one aspect, the system includes at least one semiconductor spin quantum bit (qubit); a feedline configured to act as an electron spin resonance (ESR) antenna for control of the at least one qubit; at least one resonator; and a ground plane common to both the feedline and the at least one resonator. The at least one resonator is capacitively coupled to the feedline, and configured for readout of the at least one qubit via the feedline. The feedline and the at least one resonator are arranged in adjacent layers separated by at least a dielectric. A corresponding method of performing quantum computation using such an integrated system is also provided.

Control and readout topology for spin qubits

According to an aspect of the present inventive concept there is provided a qubit device comprising: a semiconductor substrate layer; a set of control gates configured to define a row of electrostatically confined quantum dots along the substrate layer, each quantum dot being suitable for holding a qubit; and a set of nanomagnets arranged in a row over the substrate layer such that a nanomagnet is arranged above every other quantum dot of the row of quantum dots, wherein each nanomagnet has an out-of-plane magnetization with respect to the substrate layer and wherein every other quantum dot is subjected to an out-of-plane magnetic field generated by a respective nanomagnet, such that a qubit spin resonance frequency of every other quantum dot is shifted with respect to an adjacent quantum dot of the row of quantum dots.

Qubit device and a method for operating a qubit device

In one aspect, a resistive switching memory device includes a first electrode and a second electrode having interposed therebetween a first inner region and a second inner region, where the first and second inner regions contacting each other. The first inner region includes one or more metal oxide layers and the second inner region consists of a plurality of layers, where each of the layers of the second inner region is an insulating, a semi-insulating or a semiconducting layer. The second inner region comprises one or more layers having a stoichiometric or off-stoichiometric composition of a material selected from the group consisting of SiGe, SiN, AlO, MgO, AIN, HfO, HfSiO, ZrO, ZrSiO, GdAlO, DyScO, TaOand combinations thereof. The second inner region comprises one or more silicon-containing layers, such that one of the one or more silicon-containing layers contacts the first inner region.

Resistive switching memory cell

The disclosed technology generally relates to semiconductor devices and more particularly to selector devices for memory devices having a resistance switching element, particularly resistive random access memory (RRAM) devices. In one aspect, a selector device includes a first barrier structure comprising a first metal and a first semiconductor or a first low bandgap dielectric material, and a second barrier structure comprising a second metal and a second semiconductor or a second low bandgap dielectric material. The selector device additionally includes an insulator interposed between the first semiconductor or the first low bandgap dielectric material and the second semiconductor or the second low bandgap dielectric material. The first barrier structure, the insulator, and the second barrier structure are stacked to form a metal/semiconductor or low bandgap dielectric/insulator/semiconductor or low bandgap dielectric/metal structure.

Selector for RRAM

The disclosed technology generally relates to semiconductor devices and more particularly to memory devices having a resistance switching element, and to methods of operating such memory devices. In one aspect, a memory cell includes a first electrode and a second electrode formed of one of a metallic material or a semiconducting material. The memory cell additionally includes a resistance switching element formed between the first electrode and the second electrode. The memory cell additionally includes a tunnel rectifier formed between the resistance-switching element and the first electrode. The tunnel rectifier includes a multi-layer tunnel stack comprising at least two dielectric layers each having a dielectric constant (k), a conduction band offset (&#x3a6;), and a thickness, wherein one of the dielectric layers has a higher dielectric constant, a lower conduction band offset and a higher thickness compared to any other dielectric layer of the multi-layer tunnel stack.

Self-rectifying RRAM element

A method for manufacturing a non-volatile memory device is described. The method comprises growing a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored. A non-volatile memory device is also described. In the non-volatile memory device, the interpoly/blocking dielectric comprises a layer in a siliconoxide consuming material, e.g. DyScO, on top of the upper layer of the layer where charge is stored, the siliconoxide consuming material having consumed at least part of the upper layer.

Scalable interpoly dielectric stacks with improved immunity to program saturation

A non-volatile memory device having a control gate on top of the second dielectric (interpoly or blocking dielectric), at least a bottom layer of the control gate in contact with the second dielectric being constructed in a material having a predefined high work-function and showing a tendency to reduce its work-function when in contact with a group of certain high-k materials after full device fabrication. At least a top layer of the second dielectric, separating the bottom layer of the control gate from the rest of the second dielectric, is constructed in a predetermined high-k material, chosen outside the group for avoiding a reduction in the work-function of the material of the bottom layer of the control gate. In the manufacturing method, the top layer is created in the second dielectric before applying the control gate.

Non-volatile memory device with improved immunity to erase saturation and method for manufacturing same

Non-volatile memory devices are disclosed. In a first example non-volatile memory device, programming and erasing of the memory device is performed through the same insulating barrier without the use of a complex symmetrical structure. In the example device, programming is accomplished by tunneling negative charge carriers from a charge supply region to a charge storage region. Further in the example device, erasing is accomplished by tunneling positive carriers from the charge supply region to the charge storage region. In a second example non-volatile memory device, a charge storage region with spatially distributed charge storage region is included. Such a charge storage region may be implemented in the first example memory device or may be implemented in other memory devices. In the second example device, programming is accomplished by tunneling negative charge carriers from a charge supply region to the charge storage region. In the second example device, the tunneled negative charge carriers are stored in the discrete storage sites.

Method for improving erase saturation in non-volatile memory devices and devices obtained thereof

Non-volatile memory devices

An insulating barrier extending between a first conductive region and a second conductive region is disclosed. The insulating barrier is provided for tunnelling charge carriers from the first to the second region, the insulating barrier comprising a first portion contacting the first region and a second portion contacting the first portion and extending towards the second region, the first portion being substantially thinner than the second portion, the first portion being constructed in a first dielectric and the second portion being constructed in a second dielectric different from the first dielectric, the first dielectric having a lower dielectric constant than the second dielectric.

Growing community of inventors

Hulshout, Belgium

Bogdan Govoreanu