Nxp B.v.

Bodin Kasemset

Christian Zenz

Peeradech Khunpukdee

Tonny Kamphuis

Ernst Eiper

Johannes Wilhelmus Van Rijckevorsel

Boudewijn Van Blokland

David Ceccarelli

Patrick Schoengrundner

Krassavan Tantirittisak

Peeradech Kunpukdee

Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.

Inter-connection of a lead frame with a passive component intermediate structure

Integrated circuit (IC) modules and methods for manufacturing the IC modules are described. In an embodiment, an IC module includes a substrate with contact gaps on which an IC die is attached with electrical connections between the IC die and the substrate. The IC module further include an encapsulation that encloses the IC die and fills first portions of the contact gaps, where the first portions of the contact gaps are located within an area of the substrate defined by the encapsulation. Second portions of the contact gaps, which are located outside of the area of substrate defined by the encapsulation, are filled with a filling material.

Integrated circuit module with filled contact gaps

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Dual interface IC card components and method for manufacturing the dual-interface IC card components

Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds.

IC package with stainless steel leadframe

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Bangkok, Thailand

Bodin Kasemset