Growing community of inventors

Hengyang, China

Bocheng Li

Average Co-Inventor Count = 11.30

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Bocheng LiZhipeng Jiang (2 patents)Bocheng LiDehua Zou (2 patents)Bocheng LiJie He (1 patent)Bocheng LiYurong Xu (1 patent)Bocheng LiDun Mao (1 patent)Bocheng LiYun Xiang (1 patent)Bocheng LiShasha Peng (1 patent)Bocheng LiZhiqiang He (1 patent)Bocheng LiZhenyu Wang (1 patent)Bocheng LiJian Zhang (1 patent)Bocheng LiWenyuan Zeng (1 patent)Bocheng LiQiping Duan (1 patent)Bocheng LiShuwen Xiao (1 patent)Bocheng LiZhiguo Liu (1 patent)Bocheng LiChonggen Mo (1 patent)Bocheng LiQiaosha Xiao (1 patent)Bocheng LiBangwei Luo (1 patent)Bocheng LiZhenyu Chen (1 patent)Bocheng LiZhengxiong Gong (1 patent)Bocheng LiBocheng Li (2 patents)Zhipeng JiangZhipeng Jiang (2 patents)Dehua ZouDehua Zou (2 patents)Jie HeJie He (1 patent)Yurong XuYurong Xu (1 patent)Dun MaoDun Mao (1 patent)Yun XiangYun Xiang (1 patent)Shasha PengShasha Peng (1 patent)Zhiqiang HeZhiqiang He (1 patent)Zhenyu WangZhenyu Wang (1 patent)Jian ZhangJian Zhang (1 patent)Wenyuan ZengWenyuan Zeng (1 patent)Qiping DuanQiping Duan (1 patent)Shuwen XiaoShuwen Xiao (1 patent)Zhiguo LiuZhiguo Liu (1 patent)Chonggen MoChonggen Mo (1 patent)Qiaosha XiaoQiaosha Xiao (1 patent)Bangwei LuoBangwei Luo (1 patent)Zhenyu ChenZhenyu Chen (1 patent)Zhengxiong GongZhengxiong Gong (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. State Grid Corporation of China (2 from 194 patents)

2. State Grid Hunan Extra High Voltage Transmission Company (2 from 2 patents)

3. State Grid Hunan Electric Power Company Limited (1 from 4 patents)

4. State Grid Hunan Electric Company Limited (1 from 1 patent)


2 patents:

1. 12091111 - Biomimetic tower climbing robot and tower climbing method thereof

2. 11959866 - Live flaw detection system for multi-bundled conductor splicing sleeve and application method thereof

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as of
12/20/2025
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