Texas Instruments Corporation

Bobby Johns Lansangan Villacarlos

Dolores Babaran Milo

Jerry Gomez Cayabyab

Mark Gerald Rosario Pinlac

Juan Carlo Aro Rimando

A semiconductor device having a leadframe including a pad () surrounded by elongated leads () spaced from the pad by a gap () and extending to a frame, the pad and the leads having a first thickness () and a first and an opposite and parallel second surface; the leads having a first portion () of first thickness near the gap and a second portion () of first thickness near the frame, and a zone () of reduced second thickness () between the first and second portions; the second surface () of the first lead portions is coplanar with the second surface () of the second portions. A semiconductor chip () with a terminal is attached the pad. A metallic wire connection () from the terminal to an adjacent lead includes a stitch bond () attached to the first surface of the lead.

Growing community of inventors

Cabuyao, Philippines

Bobby Johns Lansangan Villacarlos