Worthen Industries, Inc.

Bob Y Chang

Vincent Chevalier

An adhesive composition for use in a shoe outsole assembly, and methods of forming the same are provided. In one aspect, the adhesive composition has a fabric layer with an adhesive applied to a top surface. In another aspect, the adhesive composition has a fabric layer with a barrier layer applied to a top surface, and an adhesive is applied to the barrier layer opposite to the fabric layer. The shoe outsole formed using the adhesive composition has the fabric material directly bonded with the outsole material such that the outsole material partially penetrates into the fabric. An adhesive is applied to the opposite side of the fabric or to the optional barrier layer which is on the opposite side of the fabric. This adhesive may then be used to bond the outsole to a shoe, such as a shoe upper, shoe midsole, and the like.

Adhesive composite

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

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Nashua, NH, United States of America

Bob Y Chang