Amkor Technology, Inc.

Bob-Shih Wei Kuo

Ahmer Raza Syed

Jesse Emmett Galloway

Frederick Evans Reed

Garry Pycroft

In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) receiver cell or die. In each embodiment of the present invention, the receiver die includes a multiplicity of through wafer vias or TWV's which are etched therethrough to effectively eliminate the bus bars on the top or front surface of the receiver die, connectors such as bus bars instead being effectively moved to the bottom or back surface of the receiver die. The movement of the connectors to the back surface of the receiver die provides the potential for a greater active surface area on the front surface for solar input.

Through wafer via structures for concentrated photovoltaic cells

A semiconductor package which is structured to allow for the edge mounting thereof in a vertical mount orientation. The semiconductor package comprises a flexible substrate or 'flex circuit.' The flexible substrate includes a conductive pattern disposed on a first surface thereof, and a plurality of conductive pads or terminals disposed on a second surface thereof which is disposed in opposed relation to the first surface. Mounted to the first surface of the flexible substrate are one or more electronic components such as semiconductor dies. The semiconductor die(s) is/are electrically connected to the conductive pattern, and thereafter covered or encapsulated by a package body applied to a portion of the first surface of the flexible substrate. That portion of the flexible substrate including the conductive pads or terminals formed on the second surface thereof is thereafter folded and adhered to a portion of the package body through the use of a suitable adhesive.

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Chandler, AZ, United States of America

Bob-Shih Wei Kuo