Amkor Technology, Inc.

Bob Shih Wei Kuo

Timothy Lee Olson

Nozad Karim

David Bolognia

Bud Troche

John Merrill Nickelsen, Jr

Jingkun Mao

In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic receiver package or module. In each embodiment of the present invention, the module comprises a leadframe including a first section and a second section disposed in spaced relation to each other. Mounted to the first section of the leadframe is a receiver die. The receiver die is electrically connected to both the first and second sections of the leadframe. In one embodiment of the present invention, the receiver die is electrically connected to the second section of the leadframe by a plurality of conductive wires. In another embodiment of the present invention, the receiver die is electrically connected to the second section of the leadframe by a conductive bonding material. Portions of the leadframe may optionally be covered by a molded body which can be used to define an alignment feature for a light concentrating device such as a light guide or optical rod.

Leadframe structure for concentrated photovoltaic receiver package

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die is attached to the first surface of the substrate and positioned over the opening. Side members are coupled to ground planes on the base substrate and cover substrate to form an RF shield around the first die. At least one wirebond having a first end attached to the first die and a second end attached to a metal trace of the base substrate is provided. The at least one wirebond forms a loop wherein a top section of the loop contacts a metal trace of the cover substrate.

Reversible top/bottom MEMS package

A semiconductor package has a substrate. An opening is formed through the substrate. A first RF shield is formed around a perimeter of the opening. A first die is attached to the first surface of the substrate and positioned over the opening.

Growing community of inventors

Chandler, AZ, United States of America

Bob Shih Wei Kuo