Growing community of inventors

Jerusalem, Israel

Boaz Weinfeld

Average Co-Inventor Count = 5.25

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 31

Boaz WeinfeldShmuel Eisenmann (4 patents)Boaz WeinfeldSagi Brink-Danan (4 patents)Boaz WeinfeldEvgeny Papeer (4 patents)Boaz WeinfeldAssaf Shaham (4 patents)Boaz WeinfeldYnon Hefets (4 patents)Boaz WeinfeldOmer Shavit (4 patents)Boaz WeinfeldYair Ferber (4 patents)Boaz WeinfeldDoron Weinfeld (2 patents)Boaz WeinfeldOded Gour Lavie (2 patents)Boaz WeinfeldQing Ma (1 patent)Boaz WeinfeldJohn Heck (1 patent)Boaz WeinfeldTsung-Kuan Allen Chou (1 patent)Boaz WeinfeldQuan Anh Tran (1 patent)Boaz WeinfeldSemeon Altshuler (1 patent)Boaz WeinfeldBoaz Weinfeld (7 patents)Shmuel EisenmannShmuel Eisenmann (16 patents)Sagi Brink-DananSagi Brink-Danan (9 patents)Evgeny PapeerEvgeny Papeer (6 patents)Assaf ShahamAssaf Shaham (5 patents)Ynon HefetsYnon Hefets (5 patents)Omer ShavitOmer Shavit (4 patents)Yair FerberYair Ferber (4 patents)Doron WeinfeldDoron Weinfeld (3 patents)Oded Gour LavieOded Gour Lavie (2 patents)Qing MaQing Ma (150 patents)John HeckJohn Heck (71 patents)Tsung-Kuan Allen ChouTsung-Kuan Allen Chou (55 patents)Quan Anh TranQuan Anh Tran (39 patents)Semeon AltshulerSemeon Altshuler (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Hil Applied Medical, Ltd. (4 from 10 patents)

2. N.t. Tao Ltd. (2 from 2 patents)

3. Intel Corporation (1 from 54,750 patents)


7 patents:

1. 12302485 - High efficiency plasma creation system and method

2. 11856683 - High efficiency plasma creation system and method

3. 10847340 - Systems and methods for directing an ion beam using electromagnets

4. 10395881 - Systems and methods for providing an ion beam

5. 10039935 - Systems and methods for providing an ion beam

6. 9937360 - Systems and methods for providing an ion beam

7. 7510907 - Through-wafer vias and surface metallization for coupling thereto

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as of
12/26/2025
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