Mellanox Technologies, Ltd.

Bar-ilan University

Pcb Technologies Ltd.

Boaz Atias

Elad Mentovich

Paraskevas Bakopoulos

Dimitrios Kalavrouziotis

Doron Naveh

Adi Levi

Donald Becker

Itshak Kalifa

Anna Sandomirsky

Tamir Sharkaz

Yaniv Rotem

Yosi Ben-naim

Eilam Zigi Ben Smolinsky

Yaad Eliya

Eran Lipp

Shlomo Danino

Yaakov Gridish

Eyal Moshe Waldman

Andrey Ger

Eyal Babish

James Stephen Fields, Jr

Ran Hasson Ruso

Nikolaos (Nikos) Argyris

Rana Darweesh

Alon Rubinstein

An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit. The first plurality of cable connectors may define a first layout, and an overall connectivity of the optoelectronic component may correspond to the first layout.

Optoelectronic component and method of manufacturing an optoelectronic component

Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

Process for localized repair of graphene-coated lamination stacks and printed circuit boards

A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.

Light emitting silicon device

Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

Process for laminating graphene-coated printed circuit boards

Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

Process for laminating conductive-lubricant coated metals for printed circuit boards

Embodiments are disclosed for generating an optical Pulse Amplitude Modulation 4-level (PAM-4) signal from bandwidth-limited duobinary electrical signals in a Mach-Zehnder modulator. An example system includes an MZM structure that comprises a first waveguide interferometer arm structure associated with a first semiconductor device and a second waveguide interferometer arm structure associated with a second semiconductor device. A polybinary electrical signal is applied to or between the first semiconductor device and the second semiconductor device to convert an input optical signal provided to the MZM structure into an optical PAM-4 signal.

Generation of an optical PAM-4 signal in a Mach-Zehnder modulator

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect includes multiple fiber cores for routing the plurality of optical communication signals between the MCM and the panel. The MCF has a first end at which the multiple fiber cores are coupled to the MCM, and a second end at which the multiple fiber cores are connected to the optical-to-optical connector on the panel.

High-density optical communications using multi-core fiber

An authentication method, network switch, and network device are provided. In one example, a method is described that includes receiving a first signal indicative of a data lane being activated and configured to carry data to or within the network switch, receiving a second signal indicative of an authentication lane being established in the network switch or a device connected to the network switch, where the authentication lane is different from the data lane, and enabling data transmission across the data lane only in response to receiving the second signal indicative of the authentication lane being established.

Authentication and data lane control

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

High density optical I/O inside a data center switch using multi-core fibers

A universal multi-core fiber (UMCF) interconnect includes multiple optical fiber cores and a shared cladding. Each of the optical fiber cores is configured to convey first optical communication signals having a first carrier wavelength using multi-mode propagation, and to convey second optical communication signals having a second carrier wavelength using single-mode propagation. The shared cladding encloses the multiple optical fiber cores.

Intra data center and inter data center links using dual-wavelength multimode/singlemode multi-core fiber

A system includes a pair of network devices, a universal multi-core fiber (UMCF) interconnect, and a pair of wavelength-division multiplexing (WDM) devices. Each network device includes (i) first optical communication devices configured to communicate first optical signals having a first carrier wavelength and (ii) second optical communication devices configured to communicate second optical signals having a second carrier wavelength. The universal multi-core fiber (UMCF) interconnect includes multiple cores that are configured to convey the first optical signals and the second optical signals between the network devices, using single-mode propagation for the first optical signals and multi-mode propagation for the second optical signals. Each WDM device is connected between a respective network device and the UMCF interconnect and configured to couple the first and second optical communication devices of the respective network device to the cores in accordance with a defined channel assignment.

Communication between data centers using a multi-core fiber

Apparatuses, systems, and associated methods are described that provide signal transmission over copper media. An example module includes a number of electrical signal generators that each generate an electrical signal, and a signal modulation system that receives the electrical signals generated by the electrical signal generators. The signal modulation system further modulates each of the electrical signals such that each modulated electrical signal is distinguishable from the other modulated electrical signals. The module further includes an active copper multiplexer in electrical communication with the electrical signal generators that receives the modulated electrical signals from the signal modulation system. The active copper multiplexer further combines the multiple modulated signals into a single combined electrical signal and transmits the single combined electrical signal through a single copper cable.

Growing community of inventors

Maale Adumim, Israel

Boaz Atias