Samsung Electronics Co., Ltd.

Bo-Young Song

Cheol-Ju Yun

Seung-hee Ko

Chae-Ho Lim

Hyun-gi Kim

Tae-Young Chung

Hyeon-Kyu Lee

Jin-A Kim

Jina Kim

A method of manufacturing a wiring structure may include forming a first conductive pattern on a substrate, forming a hardmask on the first conductive pattern, forming a first spacer on sidewalls of the first conductive pattern and the hardmask, forming a first sacrificial layer pattern on a sidewall of the first spacer, forming a second spacer on a sidewall of the first sacrificial layer pattern, removing the first sacrificial layer pattern, and forming a third spacer on the second spacer, may be provided. The third spacer may contact an upper portion of the sidewall of the first spacer and define an air gap in association with the first and second spacers. The first spacer has a top surface substantially higher than a top surface of the first conductive pattern. The second spacer has a top surface substantially lower than the top surface of the first spacer.

Wiring structures including spacers and an airgap defined thereby, and methods of manufacturing the same

First dopant regions and second dopant regions are provided at both sides of the gate structures. Conductive lines cross over the gate structures and are connected to the first dopant regions. Each of the conductive lines includes a conductive pattern and a capping pattern disposed on the conductive pattern. Contact structures are provided between the conductive lines and are connected to the second dopant regions. Each of the contact structures includes a lower contact pattern disposed on the second dopant region and an upper contact pattern disposed on the lower contact pattern. A bottom surface of the upper contact pattern is lower than a top surface of the conductive pattern.

Semiconductor device and method of forming the same

A semiconductor device includes a substrate having a plurality of active regions defined by a device isolation region, a plurality of conductive patterns on the plurality of active regions, each of the conductive patterns having side walls, a conductive line that faces the side walls of the conductive patterns with an air spacer therebetween on the active regions, the conductive line extending in a first direction, and a first insulating film covering the side walls of the conductive patterns between the air spacer and the conductive pattern. A lower portion of the first insulating film that is near the substrate protrudes toward the air spacer.

Semiconductor device

A method of manufacturing a semiconductor device includes forming a plurality of conductive lines separated from one another in a first direction via a slender hole and extending in a second direction perpendicular to the first direction, forming a first insulation layer filling the slender hole between the plurality of conductive lines, forming a plurality of first isolated holes separated from one another between the plurality of conductive lines in the first direction and the second direction by patterning the first insulation layer, forming a liner layer in the first isolated holes, filling a second insulation layer having an etching selectivity with respect to the first insulation layer, in the first isolated holes on the liner layer and forming a plurality of second isolated holes between the conductive lines by removing the first insulation layer using the etching selectivity between the second insulation layer and the first insulation layer.

Method of manufacturing a semiconductor device

A transistor includes substrate having an active region therein. The active region includes a recess therein having opposing sidewalls and a surface therebetween. A protrusion extends from the surface of the recess between the opposing sidewalls thereof. The transistor further includes a gate insulation layer on the protrusion in the recess, a gate electrode on the gate insulation layer in the recess, and source/drain regions in the active region on opposite sides of the gate electrode and adjacent to the opposing sidewalls of the recess. The gate electrode includes portions that extend into the recess between the protrusion and the opposing sidewalls of the recess. Related methods of fabrication are also discussed.

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Seongnam-si, South Korea

Bo-Young Song