Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Bo-Yong Yang

Wan-Lin Xia

Chun-Chi Chen

Tao Li

Shih-Hsun Wung

Guang Yu

Hsieh-Kun Lee

Yong-Dong Chen

Cheng-Tien Lai

Zhi-Yong Zhou

Yong Zhong

Jin-Song Feng

Min-Qi Xiao

Bao-Chun Chen

Shin-Hsuu Wung

A heat dissipation device () includes a first heat sink (), a second heat sink () and a heat pipe () transferring heat from the first heat sink to the second heat sink. A bracket () includes a first end () attached to the first heat sink and a second end () attached to the second heat sink.

Heat dissipation device having a bracket

A heat sink assembly () includes a heat sink () and a wire clip (). The heat sink includes a base () and a plurality of fins () mounted on the base. A channel () is defined between two neighboring ones of the fins. A pair of points () are punched on one of the fins and received in the channel. The wire clip includes a main body (), first and second legs () extending from opposite ends of the main body. The wire clip intervenes across the points and extends through the channel such that the main body is received in the channel and the first and second legs are located at opposite ends of the channel. Thus, the wire clip is prevented from dropping from the channel in a direction parallel to the channel.

Heat dissipation device

A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.

Heat sink

A fastening assembly is for securing a heat sink to a heat generating electronic device located on a printed circuit board. The fastening assembly includes a first element and a second element slidably received in the first element. The first element includes a pressing portion, a plurality of outer flexible portions located below the pressing portion and a plurality of inner flexible portions integrally extending inwards from the outer flexible portions, respectively. The pressing portion of the first element presses downwardly the heat sink toward the electronic device. The outer flexible portions of the first element abut upwardly against the printed circuit board. The second element is capable of acting on the inner flexible portions of the first element to motivate the outer flexible portions to release their abutment from the printed circuit board.

Heat sink fastening assembly

A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.

Heat sink fastener

A heat dissipation device includes a heat sink () having a plurality of fins (), a fan duct (), a fan () and a mounting bracket () for mounting the fan duct and the fan to the heat sink. The fan duct is mounted to a front side of the heat sink, and includes an inlet, an enlarged outlet covering the front side of the heat sink and at least two channels (). The fan duct is capable of expanding an airflow generated by the fan by the enlarged outlet and dividing the airflow by the at least two channels into at least two sub-airflows. Thus, the fan can blow the airflow through all of the fins to thereby promote a heat dissipating efficiency of the heat dissipation device.

Heat dissipation device having a ventilating duct

A locking device includes a flat plate for contacting with a heat-generating electronic component, a plurality of fins mounted on the flat plate, four locking feet and four fasteners. The flat plate includes two locking portions at opposite sides thereof. Each locking foot includes two spaced pivot plates at an end thereof, wherein the locking portions of the flat plate are sandwiched between the pivot plates. The locking feet are pivotably connected to the locking portions. The fasteners are secured to ends of the locking feet respectively, opposite to the ends where the spaced pivot plates are formed. The locking feet are pivotably movable between first and second positions. The locking device can be mounted to a first-typed PCB at the first position and a second-typed PCB at the second position.

Universal locking device for heat sink

A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the base. The condensing section of the heat pipe departs from the base. The fins are stacked on the heat pipe and the reinforcing member. Therefore, the heat dissipation device has steady configuration and low cost.

A heat sink fastener includes a main body, a piercing body and an operating member. The main body includes a pressing part adapted for pressing a heat sink toward a heat-generating component, an engaging part and a latching leg, the engaging part and the latching leg being disposed at opposite ends of the pressing part. The piercing body includes a piercing part piercing through the engaging part and movable up and down in the engaging part, and a latching part below the piercing part and facing the latching leg. The operating member is connected to the piercing part and linearly movable along a direction perpendicular to the engaging part to put the pressing part in tension by exerting a force on the engaging part or to relax the tension by relieving the force exerted on the engaging part.

A heat dissipating device assembly for an electronic components (), includes a heat sink () for contacting the electronic component, and a locking device () and a back plate unit () for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module () located around the electronic component for supporting the heat sink thereon, and a clip () pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

Heat dissipating device assembly

A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the base, and a protective cover firmly disposed around the base of the core. An offset exists between the bottom face of the cover and the spread area of the medium.

Heat dissipation device incorporating with protective cover

A heat dissipation device includes a first heat sink (), a second heat sink () and at least one heat pipe (). The first heat sink includes a first base () and a plurality of fins (). The second heat sink includes a second base () and a plurality of fins (). The second heat sink is located above and faced to the first heat sink. At least one fin () of the first heat sink forms a bifurcated portion () at an upper section thereof. A corresponding fin () of the second heat sink is fixed to the bifurcated portion of the bifurcated fin via soldering process. The heat pipe interconnects the first base and the second base.

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Shenzhen, China

Bo-Yong Yang