Samsung Electronics Co., Ltd.

Bo-Woo Kim

Jung-Hyeon Kim

Jong-won Han

Seok Goh

Ho-Jeong Choi

Byoung-jun Min

Sang-Sik Lee

A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

Growing community of inventors

Suwon-si, South Korea

Bo-Woo Kim