Industrial Technology Research Institute

Bo-Tseng Sung

Shih-Hsiang Chien

Chin-Hone Lin

Ching-Jin Tyan

An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second metal plates, and an annular frame. The first metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; at least one of the first metal plates may include a plurality of chip slots. The chips may be disposed at the chip slots; each of the chips may be electrically coupled to one of the adjacent first metal plates. The second metal plates may be parallel to each other/one another, and electrically coupled to the gate driver circuit; each of the second metal plates may be disposed between any two adjacent first metal plates. The first metal plates, the second metal plates, the gate driver circuit, and the chips may be disposed inside the annular frame.

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Hsinchu, Taiwan

Bo-Tseng Sung