Seoul Viosys Co., Ltd.

Bo Ram I Jang

Hee Cheul Jung

Jun Yong Park

Daewoong Suh

Kyu Ho Lee

Dae Woong Suh

Chang Hoon Kim

Jung Hye Chae

Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.

Light-emitting diode package and method for manufacturing same

The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.

Light-emitting diode package

Growing community of inventors

Ansan-si, South Korea

Bo Ram I Jang