Verily Life Sciences LLC

Galvani Bioelectronics Limited

Bo Lu

Annapurna Karicherla

Brian Pepin

Benjamin K Yaffe

Kedar G Shah

Ken Rys

Huanfen Yao

Shiv Sabesan

Stephen O'Driscoll

Peng Cong

Shivkumar Sabesan

Cindy Au

Ohseung Kwon

Kenneth Rys

Brain Marc Pepin

The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.

Connectors for high density neural interfaces

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to anatomically contoured spinal cord stimulation leads for high density neural interfaces and methods of microfabricating the stimulation leads. Particularly, aspects are directed to a thin film lead assembly that includes a cable having: a first supporting structure formed of dielectric material, a first set of conductive traces formed on the first supporting structure, a second supporting structure formed of dielectric material, and a second set of conductive traces formed on the second supporting structure. The thin film lead assembly also includes an electrode assembly having: a third supporting structure formed of dielectric material, a first set of electrodes in electrical connection with the first set of conductive traces, and a second set of electrodes in electrical connection with the second set of conductive traces.

Anatomically contoured stimulation leads for high density neural interface

Embodiments relate to an implantable device. Specifically, a device includes a flexible connection component that includes a set of conductive filaments that connect a set of electrodes (or traces connected to the electrodes) and circuitry that receives and/or transmits electronic signals from and/or to the electrodes.

Implantable medical devices with microfabricated leads

The present disclosure relates to mapping catheters, and in particular to mapping catheters having thin film electrodes used in sensing electrical activity within a patient. Particularly, aspects of the present disclosure are directed to a medical device having a hollow core, a balloon disposed over at least a portion of the hollow core, and a flexible framework having one or more thin film elements formed on at least a portion of the balloon. The one or more thin film elements comprise a plurality of mapping electrodes.

Thin film mapping catheter

The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Branched proximal connectors for high density neural interfaces

The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a main body, a first plug extending from the main body, a flexible bridge extending from the main body or the first plug, and a second plug extending from the flexible bridge. This structure allows for the main body, the first plug, and the second plug to be arranged in tandem on a longitudinal axis of the main body, which enables the connector to be passed through a narrow diameter cannula. This structure also allows for the first plug and the second plug to be arranged in a spread out orientation, which enables the connector to be electrically connected with a neurostimulator.

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

Monolithic lead assembly and methods of microfabricating a monolithic lead assembly

A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.

Stimulation system with monolithic-lead component connected to skull mount package

The present disclosure relates to a medical device, methods of making a medical device, and methods of delivering medical device. Particularly, aspects of the present disclosure are directed to a medical device having a self-expanding stent and a thin-film neural interface. The stent comprises a plurality of struts having a substantially elliptical or circular geometry arranged in series from a proximal end to a distal end of the stent, and a thin-film neural interface attached to the stent. Each strut of the self-expanding stent comprises a top portion and a base portion integrally connected with the top portion at a first connection point and a second connection point such that the top portion moves relative to the base portion. The self-expanding stent provides a retracted configuration to protect the thin-film neural interface during delivery, and an expanded configuration to deploy the thin-film neural interface.

Self-expanding stent including a thin-film neural interface and method of delivering a thin-film neural interface using a self-expanding stent

An electrode system for neuromodulation and for recording of signals indicative of nerve activity is provided. The system can include a plurality of electrodes provided on a flexible, non-conductive substrate. The substrate can be rolled into a cuff for encircling a nerve bundle of a patient. The plurality of electrodes on the cuff can be interconnected using flexible conductors provided on the substrate. In one implementation, the electrodes can be interconnected using conductors that have spring-like configuration. Flexibility of the conductors allows the cuff to expand and contract with the nerve without causing excessive stress/strain at the nerve-cuff interface.

Extraneural cuff with flexible interconnects for stimulation and recording

Thin film connectors are described for connecting a lead assembly and a data acquisition system. Particularly, a connector includes a button having a housing and conductive pins extending from a proximal end of the housing through a base plate into a cavity on a distal end of the housing. The connector further includes a thin-film adapter having: (i) a supporting structure, (ii) bond pads formed on the supporting structure, (iii) a cable having conductive traces electrically connected to the bond pads, and (iv) feedthroughs that pass through the supporting structure and are electrically connected with the bond pads. Each conductive pin extends through a feedthrough, and each conductive pin is in electrical connection with one or more conductive traces via each bond pad.

Thin-film connectors for data acquisition system

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire.

Thin-film electrode assembly with soft overmold

The present disclosure relates to data acquisition, and in particular to thin film connectors between a lead assembly and a data acquisition system. Particularly, aspects of the present disclosure are directed to a connector that includes a button having a housing and conductive pins extending from a proximal end of the housing through a base plate into a cavity on a distal end of the housing. The connector further includes a thin-film adapter having: (i) a supporting structure, (ii) bond pads formed on the supporting structure, (iii) a cable having conductive traces electrically connected to the bond pads, and (iv) feedthroughs that pass through the supporting structure and are electrically connected with the bond pads. Each conductive pin extends through a feedthrough, and each conductive pin is in electrical connection with one or more conductive traces via each bond pad.

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Santa Clara, CA, United States of America

Bo Lu