Samsung Electro-Mechanics Co., Ltd.

Bo Hyun Seo

Young Ki Lee

Seog Moon Choi

Hong Seok Lee

Sung Youl Choi

Tae Gyu Ryu

A communication module includes: a substrate; a supplementary substrate disposed to surround an electronic element mounted on a lower surface of the substrate; a molding material configured to seal an electronic element mounted on an upper surface of the substrate; and a shielding layer disposed on a side surface and an upper surface of the molding material, a side surface of the supplementary substrate, and a side surface of the substrate. The supplementary substrate includes: a plurality of first pads disposed on an upper surface of the supplementary substrate; a plurality of second pads disposed on a lower surface of the supplementary substrate; a plurality of vias connecting the plurality first pads to the plurality of second pads; and a ground pad disposed on the side surface of the supplementary substrate. The ground pad includes an extender connected to a corresponding first pad and a corresponding second pad.

Communication module

An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

Growing community of inventors

Suwon-si, South Korea

Bo Hyun Seo