Semiconductor Manufacturing International (Shanghai) Corporation

Semiconductor Manufacturing International (Beijing) Corporation

Schneider Electric It Corporation

Hon Hai Precision Industry Co., Ltd.

Ambit Microsystems (Shanghai) Ltd.

Bo Hong

Shuai Zhang

John H Bean, Jr

Hongwei Yang

Qiang Meng

Qiang Li

Jinhui Wang

Marlowe Dulaca Apuhin

Qiang Lqli

Min Jin

Jui Lin Lu

Pu-Cun Du

Yao-Shun Chuang

A receiver of a cooling unit includes a cylindrical body having a cylindrical wall that defines an interior chamber, a bottom wall formed with the cylindrical wall, and a top wall formed with the cylindrical wall. The receiver further includes an inlet provided in the cylindrical body, an outlet provided in the cylindrical body, a heater well disposed within the cylindrical body, and a heater positioned in the heater well to selectively heat a heat transfer fluid contained within the interior chamber of the cylindrical body. The heater well can be configured to extend from the top wall to adjacent the bottom wall along an axis that is coaxial with an axis of the cylindrical wall of the cylindrical body or extend horizontally adjacent the bottom wall of the cylindrical body.

Receiver for cooling system

A system for removing condensate from a cooling unit () includes a drain pan () to collect condensate generated by the cooling unit (), a condensate pump () configured to pump condensate from the drain pan (), and a water tank () in fluid communication with the condensate pump (). The water tank () is configured to store condensate in the form of water delivered to the water tank () by the condensate pump (). The system further includes a plunger pump () in fluid communication with the water tank (). The plunger pump () is configured to pump water from the water tank (). The system further includes at least one atomizing nozzle () in fluid communication with the plunger pump (). The at least one atomizing nozzle () is configured to atomize water from the plunger pump ().

System and method for removing condensate from a cooling unit

Memory cells and fabrication methods thereof are provided. An exemplary method includes providing a substrate having a well region; forming a select gate structure, a floating gate structure and a dummy gate structure on a surface of the well region; forming a first lightly doped region, a second lightly doped region and a third lightly doped region in the well region, the first lightly doped region and the second lightly doped region being at two sides of the select gate structure respectively, the second lightly doped region being in between the select gate structure and the floating gate structure, and the third lightly doped region being in between the floating gate structure and the dummy gate structure; and forming bit line region in the first lightly doped region and a source region in the third lightly doped region, the source region being enclosed by the third lightly doped region.

Memory cell and fabrication method thereof

A method for manufacturing a semiconductor device includes providing a substrate structure including a substrate having multiple structures. Each of the structures includes an active region isolated by trenches in the substrate, an insulating layer on the active region, and a hardmask layer on the insulating layer. The method also includes performing a first ion implantation into a first structure configured to form a first type device, performing a pull-back process on the hardmask layer and on the insulating layer of the first structure to form a receded hardmask layer and a receded insulating layer and expose a corner portion of the active region, and performing a rounding process on the exposed corner portion. The rounded corner portion of the active region has an increased curvature radius that reduces the concentration of the electric field and improves the reliability of the semiconductor device.

Method of high voltage device fabrication

A modem to process calling packets includes receiving a calling request packet from a software phone of a communication terminal, and determining if the calling request packet includes a special tag. If the IP phone is idle, the modem records a source IP address of the calling request packet, and modifies the source IP of the calling request packet to be an IP address of the IP phone, then the modem transmits the modified calling request packet to a server, and receives a calling reply packet from the server, then modifies a destination IP address of the calling reply packet to be the IP address of the communication terminal. The modem transmits the modified calling reply packet to the software phone to establish the call.

Modem and calling packet processing method thereof

Growing community of inventors

Shanghai, China

Bo Hong