Intel Corporation

Shanghai University of Engineering Science

Bo He

Vincent J Zimmer

Sarathy Jayakumar

Ying Liu

Di Zhang

Zhuangzhi Li

Zhi Jin

Shuang Gao

Liang Lan

Guomin Jiang

Zhijun Tan

Lin Chen

Qi Zhang

An electronic device is disclosed, including a first set of processor cores including at least one processor core and a second set of processor cores including at least one processor core. The electronic device is configured such that during initialization of the electronic device: the first set of processor cores executes first initialization instructions in a first execution environment, the second set of processor cores executes second initialization instructions in a second execution environment, and the first set and the second set at least one of read or write to a shared register.

Decoupling silicon initialization and bootloader by providing silicon initialization service

The present invention discloses a composite device for high-precision laser additive/subtractive manufacturing, which consists of a sealed shaping chamber, an inert protective gas source and a machine-shaping platform; wherein, the inert protective gas source is connected to the sealed shaping chamber; and the machine-shaping platform is arranged in the sealed shaping chamber, as well as there is a light path selection system is arranged right above the machine-shaping platform; in addition, there is a machining position is equipped on the machine-shaping platform, meanwhile, there are lead screws are arranged under the machine-shaping platform.

Composite device for high-precision laser additive/subtractive manufacturing

Growing community of inventors

Shanghai, China

Bo He