Siliconware Precision Industries Co., Ltd.

Bo-Hao Ma

Chee-Key Chung

Chi-Ching Ho

Chang-Fu Lin

Hong-Da Chang

Kong-Toon Ng

Chen-Yu Huang

Rui-Feng Tai

Ching-Hung Tseng

Yu-Ting Xue

Guan-Hua Lu

Chun-Chi Ke

Hsin-Yi Liao

Cheng-Kai Chang

A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Carrying substrate, electronic package having the carrying substrate, and methods for manufacturing the same

An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.

Electronic package and manufacturing method thereof

An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Method for fabricating electronic package

A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.

Method for fabricating an encapsulated electronic package using a supporting plate

Electronic package

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Taichung, Taiwan

Bo-Hao Ma