Lumens Co., Ltd.

Hyundai Motor Company

Bo Gyun Kim

Seung Hyun Oh

Yun Geon Cho

Byeong Cheol Shim

Jong Kyung Lee

Suk Min Han

Young Mi Na

Jun Hyeok Han

Jung Hyun Park

Hyo Gu Jeon

Dae Gil Jung

In Woo Son

Disclosed are a lens for a light-emitting device usable in a display apparatus or a lighting apparatus, and a method of manufacturing a light-emitting device package. The lens may include a lens body including a light-receiving portion provided in a lower surface of the lens body, a light-emitting portion provided on an upper surface of the lens body, and a recess provided at a center of the upper surface of the lens body, and a flat portion provided in a horizontal shape on a bottom surface of the recess perpendicularly to a main emission line of light emitted from a light-emitting device to emit at least a part of light received through the light-receiving portion, upward. A diameter of the flat portion may be 1/100 to 1/10 of an inlet diameter of the light-receiving portion.

Lens for light-emitting device and method of manufacturing light-emitting device package

Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.

Semiconductor light emitting element and backlight assembly including the same

Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

Light emitting device package and light emitting device package module

A method for servicing a call with a door phone includes: requesting, by a server on a network supporting interworking between the door phone and a vehicle telematics terminal, vehicle information from the vehicle telematics terminal due to a service request from a smart terminal in a home in response to an action of the door phone; receiving, at the server, the vehicle information from the vehicle telematics terminal; and providing, by the server, a call connection between the door phone and the vehicle telematics terminal based on whether or not a vehicle is being driven, as determined by the received vehicle information.

Method and system for servicing call with doorphone using telematics

Growing community of inventors

Hwaseong-si, South Korea

Bo Gyun Kim