Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Sanechips Technology Co., Ltd.

Nima Saati

Bo Deng

Xian-Guang Tan

Ji-Chao Li

Chang Zhu

Jia-Qi Dong

Xiao-Feng Cao

Li Dai

Jia Qun Fang

Jin Wen Li

Zhenwei Guo

Ming Fu Tseng

A decoding method and apparatus, a network device, and a storage medium are provided. The method includes: receiving data before de-interleaving and soft bit encoding locations; dividing the data before de-interleaving to obtain first data banks; acquiring punctured data, and obtaining second data banks according to the punctured data, wherein the data before de-interleaving and the punctured data are determined in encoded data according to the soft bit encoding locations; and performing decoding according to the soft bit encoding locations, the first data banks and the second data banks, so as to obtain decoded data.

Decoding method and apparatus, network device, and storage method

An improved 360 degree surround sound performance, 100 to 150 output wattage, low frequency driver portable wireless, Bluetooth compatible system is disclosed utilizing a sound reflective surface. In this system, a sound enclosure is formed including inner and outer half-spherical shaped, side wall enclosures, and as a bottom surface an elevated horizontal base region. A low frequency mounted driver is facing downward and mounted within a downward facing aperture of the inner half-spherical spaced, side wall enclosures and within an inner surface of the elevated horizontal base region. A pair of oppositionally mounted drivers, facing outward is mounted within oppositionally mounted, side apertures of the inner spaced apart, half-spherical shaped, side wall enclosures. Half-spherical shaped bowls couple to a back portion of the oppositionally mounted, side apertures. A phase plug couples to side apertures of the outer spaced apart, half-spherical shaped, side wall enclosures via straps and mounts in front of and spaced-apart from each of the pair of the oppositionally mounted drivers, facing outward.

100 to 150 output wattage, 360 degree surround sound, low frequency speaker, portable wireless bluetooth compatible system

A voltage measuring apparatus electrically connected to buck circuits includes the same number of RC circuits as there are buck circuits, an analog/digital (A/D) convertor, a controller, and a display unit. Each RC circuit is configured to be electrically connected in parallel with an inductor of one corresponding buck circuit. The A/D convertor selectively obtains an analog voltage of one of the buck circuits, and converts the analog voltage signal into a digital voltage signal. The controller controls the A/D convertor and receives the digital voltage signal from the A/D convertor. The display unit displays a decimal voltage value based on the digital voltage signal.

Voltage measuring apparatus for buck circuit

A speed adjustment circuit for a plurality of fans includes a voltage input terminal, a plurality of speed control modules, and a fan tachometer. Each of the speed control modules includes a fan connector, a speed adjusting unit, and a detector switch unit. The speed adjusting unit includes a switching control unit, a voltage adjusting chip, and a variable resistor. The detector switch unit includes a first switch. The voltage input terminal connects to the input terminal of the voltage adjusting chip through the switching control unit. The output terminal of the voltage adjusting chip connects to the power pin of the fan connector. The adjusting terminal of the voltage adjusting chip connects to ground through the variable resistor, and connects to the output terminal of the voltage adjusting chip through a resistor. The detection pin of the fan connector connects to the fan tachometer through the first switch.

Speed adjustment circuit for a plurality of fans

A motherboard system includes a PCB, a CPU socket mounted on the PCB, a heat dissipating device, and a number of fastening devices. The CPU socket is configured for receiving a CPU. The heat dissipating device is mounted on the CPU socket for dissipating heat generated by the CPU. The fastening devices extend through the heat dissipating device and the CPU socket and are engaged in the PCB, thereby fastening the heat dissipating device, and the CPU socket to the PCB.

Motherboard system having heat dissipating device

An over-current protection apparatus includes a first connector connected to a power supply, a second connector connected to a motherboard. A non-inverting input terminal of a comparator receives a voltage from a power supply and compares the received voltage with a preset voltage, when the received voltage is greater than the preset voltage. The comparator outputs a high level signal to control a first electrical switch to be turned on and a second electrical switch to be turned off. A clock pin of a flip-flop receives a high level signal from the second electrical switch, and an output terminal of the flip-flop outputs a low level signal to a third electrical switch, to control the third electrical switch to be turned off. A control pin of a first connector is disconnected to a control pin of a second connector and the power supply does not provide voltages to a motherboard.

Growing community of inventors

Shenzhen, China

Bo Deng