Microsoft Technology Licensing, LLC

Bo Dan

Chau Van Ho

Robert Ullman Myers

Eugene Lee

Han Li

Lincoln Matthew Ghioni

James David Wahl

Spencer B Eggert

Brandon Earl Gary

Gary Russell McClary

Aaron Ray Paff

Shalini Majumdar

Raghavendra S Kanivihalli

Andrew William Hill

Jaejin Lee

Andrew Douglas Delano

Brian Joseph Toleno

Tianyu Zhao

James Hao-An Chen Lin

Siddharth Bhopte

Sahar Vilan

Matthew Gen

Bharath Nagendran

Greg Nielsen

Cindy Martinez

Gary Russell Mcclary

Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

Conformal electromagnetic interference shielding film

Thermal management devices and systems, and corresponding methods of cooling an electronic device are described herein. A method for cooling an electronic device that includes a housing and a vent in the housing includes monitoring, by a sensor, an operating condition of the electronic device. The vent is opened or closed based on the monitored condition of the electronic device.

Self-adaptive vents

A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.

Radio frequency filter fin pack design in consumer electronics

A method of manufacturing an impeller for a thermal management device includes partially curing a curable liquid in a curable liquid bath to form a first stage rotor, removing the first stage rotor from the curable liquid bath, the first stage rotor having excess curable liquid on a surface thereof, rotating the first stage rotor to displace the excess curable liquid radially outward from a rotational axis to compensate for imbalances in the first stage rotor, and fully curing the first stage rotor and at least a portion of the excess curable liquid to produce a second stage rotor that is more rotationally balanced than the first stage rotor.

Dynamic balancing of additively manufactured impellers

Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

Device configuration-based thermal management control

A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Vapor chamber on heat-generating component

A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

Ventilated shield can

Cooling of a computing device is described herein. The computing device includes a plurality of fans, a plurality of sensors, and a processor in communication with the plurality of fans and the plurality of sensors. Each sensor of the plurality of sensors is associated with at least one fan of the plurality of fans and is operable to determine a temperature. The processor is configured to determine, for each sensor of the plurality of sensors, a difference between the determined temperature and a predetermined temperature corresponding to the sensor. The processor is also configured to compared the determined differences. The processor is configured to increase a speed of at least a first fan of the plurality of fans based on the comparison, and determine which fan of the plurality of fans to decrease fan speed based on the increased speed of the first fan.

Adaptive cooling techniques in electronic devices

Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

Adaptive airflow guides in an electronic device

The disclosed technology includes a thermal management hinge connecting at least two hinged components of a computing device. The thermal management hinge has at least two different thermal orientations for managing thermal conditions within each of the hinged components. For example, the thermal management hinge may have a thermally conductive orientation and the thermally insulating orientation.

Thermal management hinge

Techniques for selectively rotatable feet for an apparatus are described. According to various implementations, an apparatus includes feet on its base that cushion the apparatus on an adjacent surface, such as a desk, a table, and a floor. The feet are rounded (e.g., spherical) and can rotate relative to the base to enable the apparatus to be moved on an adjacent surface. To prevent unwanted movement during a typical usage, the apparatus includes brakes that engage with the feet to prevent rotation. The brakes, however, can be selectively disengaged from different feet to enable different types of movement of the apparatus, such as rotational and translational movement.

Selectively rotatable feet for an apparatus

Cooling of at least two heat generating electronic components of a computing device is described herein. The computing device includes the at least two heat generating electronic components. The at least two heat generating electronic components includes a first heat generating electronic component and a second heat generating electronic component. The first heat generating electronic component and the second heat generating electronic component are in thermal communication. The computing device also includes a first sensor operable to measure a first temperature. The first temperature is associated with the first heat generating electronic component. The first heat generating electronic component, the second heat generating electronic component, another heat generating electronic component of the at least two heating generating electronic components, or any combination thereof is configured to compare the first measured temperature to a predetermined temperature, and decrease a power for the second heat generating electronic component based on the comparison.

Growing community of inventors

Redmond, WA, United States of America

Bo Dan