Unisys Corporation

Blanquita Ortega Morange

Jerry Ihor Tustaniwskyj

James Wittman Babcock

Angela M Torres

James A Roecker

Wilber Terry Layton

Wilbur T Layton

Lorraine Lo-Lan Wing

A heat-exchanger in a chip tester includes an electric heater and a heatsink which are joined together with a layer of an attach material. The operational period of this heat-exchanger is extended by a method which includes the steps of: 1) testing chips in the chip tester in a manner that puts the heat-exchanger through multiple temperature changes which keep the layer in a solid state and which induce stress-cracks in the layer; 2) subjecting the layer to a crack-healing temperature cycle in which the layer is melted at least partially and re-solidified; and thereafter, 3) repeating the testing step.

Method of extending the operational period of a heat-exchanger in a chip tester

The temperature of multiple integrated circuit modules is regulated by a heat exchanger which is sequentially squeezed against, and separated from, a respective uneven contact surface on each of the modules. The heat exchanger has a face of a malleable metal that stays in a solid state and deforms while the squeezing occurs. The surface of the malleable metal has a coating of a release agent that prevents the malleable metal from sticking to the contact surface.

Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent

A heat exchanger, for regulating the temperature of multiple integrated circuit modules, is fabricated by constructing a face on a hollow jacket such that the face consists essentially of a malleable metal with a coating of a release agent. In one embodiment, the malleable metal is fabricated as a foil which is attached to the jacket by an adhesive, and the coating is fabricated as a powder of the release agent which is rubbed into the surface of the foil.

Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent

An alloy film is fabricated, on the face of a heat exchanger for an integrated circuit, by a process that dispenses various liquids onto the heat exchanger's face. To prevent those liquids from falling off of the heat exchanger's face onto other components which hold the heat exchanger on a frame, the process begins by combining the heat exchanger into an assembly that includes a retainer and a compliant member. The retainer catches any liquids that fall off the heat exchanger's face, and the compliant member forms a seal between the heat exchanger and the retainer which prevents the liquids from leaking onto the other components.

Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit

A mechanical assembly is comprised of a heat exchanger for an integrated circuit. In the assembly, a retainer for a liquid has a bottom with an opening thru which the heat exchanger extends such that a face of the heat exchanger is surrounded by the retainer. Also in the assembly, a compliant member forms a seal for the liquid between the heat exchanger and the retainer. This mechanical assembly is useful in fabricating an alloy film on the heat exchanger's face.

Mechanical assembly for fabricating an alloy film on a face of a heat exchanger for an integrated circuit

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200.ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

Method of fabricating an integrated circuit package having a liquid

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200 .ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

Integrated circuit package having a liquid metal-aluminum/copper joint

An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.

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Poway, CA, United States of America

Blanquita Ortega Morange