Intel Corporation

Arizona Board of Regents, a Body Corporate

Blake Rogers

Ravindranath Vithal Mahajan

Je-Young Chang

Devdatta P Kulkarni

Amaneh Tasooji

Jae W Kim

A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface. The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.

Heat management system

Exemplary systems and methods allow for precise formation and subsequent characterization of electrical interconnects, for example solder joints associated with integrated circuit packages. The system may utilize a cartridge-like structure for use in aligning the metal components to be interconnected, and to facilitate subsequent testing of the interconnect.

Systems and methods for interconnect simulation and characterization

Growing community of inventors

Mesa, AZ, United States of America

Blake Rogers