Few Fahrzeugelektrikwerk Gmbh & Co. Kg

Björn Schneider

David Roger

Felix Tischer

André Jenrich

Roy Gleisberg

Werner Hartmann

Mounting devices

Mounting device

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.

Method for forming a bonded joint

The invention relates to an electrical connector element for contacting a conductive structure arranged on a flat carrier wherein the contacting is performed by a thermally bonded connecting material, wherein devices for fixing an advantageously flexible conductor are arranged on one side, wherein the connector element is configured as a soldering base or soldering bridge with a connector portion, characterized in that at least a portion of the soldering base or of the soldering bridge that is to be connected with the conductive structure is configured as a fanned area and includes at least two bars that are offset from each other by a slot.

Electrical connector element

An electrical connection element for fastening, in particular soldering, to a glass pane and conductive sections present there, in particular to a vehicle pane, consisting of a solder connection part and a ribbon litz wire section fixed to the solder connection part by welding. The ribbon litz wire section consists of a mixed braid which, in addition to single wires made of copper or a copper alloy, contains single wires made of a material which has a melting temperature that corresponds substantially to the melting temperature of the solder connection part or has a higher melting temperature than the latter.

Electrical connection element for fastening, in particular soldering, to a glass pane, and ribbon litz wire mixed braid

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Markkleeberg, Germany

Björn Schneider