Flisom Ag

Björn Keller

Roger Ziltener

Roland Kern

David Bremaud

A method to fabricate monolithically-integrated optoelectronic module apparatuses () comprising at least two series-interconnected optoelectronic components (). The method includes deposition and scribing on an insulating substrate or superstate () of a 3-layer stack in order (a, b, c) or (c, b, a) comprising: (a) back-contact electrodes (), (b) semiconductive layer (), and (c) front-contact components (). Via holes () are drilled so that heat of the drilling process causes a metallization at the surface of said via holes that renders conductive the semi-conductive layer's surface () of said via holes, thereby establishing series-interconnecting electrical paths between optoelectronic components () by connecting first front-contact components () to second back-contact electrodes ().

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Frauenfeld, Switzerland

Björn Keller