Osram Opto Semiconductors Gmbh

Osram Gmbh

Bjoern Hoxhold

Bernd Boehm

Andreas Dobner

Ludwig Hofbauer

Stefan Hartauer

Andreas Waldschik

Daniel Zaspel

Stefan Merl

Stefan Rass

Matthias Stark

Hermann Nuss

Erwin Beer

In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.

Optoelectronic device and method for producing an optoelectronic device

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (), comprising the following steps: A) arranging at least one semiconductor chip () on a carrier (), B) applying an electrically insulating photoresist () to a top side () of the carrier () and to the semiconductor chip (), C) curing the photoresist () with a baking step, D) patterning the photoresist () by exposure, F) developing the photoresist (), wherein the photoresist () is removed at least from a radiation penetration surface () of the semiconductor chip (), G) again curing the photoresist () with a baking step, and H) applying an electrically conductive contact layer () to the photoresist (), wherein the electrically conductive contact layer () is in places at a distance (A) from a marginal surface () of the photoresist () which faces towards the semiconductor chip (), wherein the marginal surface () facing towards the semiconductor chip () is exposed in places.

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

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Sinzing, Germany

Bjoern Hoxhold