Infineon Technologies Austria Ag

Infineon Technologies Ag

Bjoern Fischer

Armin Willmeroth

Franz Hirler

Joachim Weyers

Gerhard Enders

Markus Schmitt

Winfried Kaindl

Peter Voigt

Katarzyna Kowalik-Seidl

Rene Mente

Giulio Fragiacomo

Matthias Wegscheider

Hans Weber

Helmut Schneider

Dietrich Bonart

Christian Fachmann

Andreas Riegler

Gabor Mezoesi

A switched-mode power supply includes a power semiconductor device that includes a semiconductor body comprising transistor cells and a drift zone between a drain layer and the transistor cells, the transistor cells comprising source zones, wherein the device exhibits a first output charge gradient when a voltage between the drain layer and the source zones of the transistor cells increases from a depletion voltage of the semiconductor device to a maximum drain/source voltage of the semiconductor device, wherein the device exhibits a second output charge gradient when a voltage between the drain layer and the source zones of the semiconductor device decreases from the maximum drain/source voltage to the depletion voltage of the semiconductor device, and wherein the semiconductor device is configured such that the first output charge gradient deviates by less than 5% from the second output charge gradient.

Power semiconductor device having vertically parallel p-n layers formed in an active region under transistor cells and under a non-depletable extension zone formed in the edge region

A semiconductor device includes a semiconductor body having opposing first and second surfaces in a vertical direction, a first semiconductor region of a first doping type electrically coupled to a first terminal, a second semiconductor region of a second doping type electrically coupled to a second terminal, and a third semiconductor region of the second doping type, but less highly doped than the second semiconductor region, extending in an active region of the semiconductor device from the first to the second semiconductor region in the vertical direction. A horizontal field-stop-region of the first doping type extends in an edge region of the device from the first semiconductor region into the semiconductor body in the vertical direction, such that it directly adjoins the first and second semiconductor regions. A horizontal compensation region of the first doping type extends from the horizontal field-stop-region into the second semiconductor region in a horizontal direction.

Semiconductor device

A power converter circuit includes an inductor and rectifier circuit having an inductor connected in series with an electronic switch, and a rectifier circuit, and a controller for generating a drive signal for driving the electronic switch. The electronic switch has drain, source and gate nodes, drift and compensation cells each including a drift region of a first doping type and a compensation region of a second doping type, and a control structure connected between the drift region of each of the drift and compensation cells and the source node. Each drift region is coupled to the drain node and each compensation region cells is coupled to the source node. A first type doping concentration Nof the drift region is higher than a first doping level L, and a second type doping concentration Nof the compensation region is higher than a second doping level L.

Power converter circuit having a controller for generating a drive signal for driving an electronic switch with high avalanche robustness

A transistor device includes at least one transistor cell, having, in a semiconductor body, a source region of a first doping type in a body region of a second doping type, a drain region, and a drift region of the first doping type adjoining the body region and arranged between the body region and the drain region. A low-resistance region of the second doping type in the body region adjoins the source region. A gate electrode dielectrically insulated from the source and body regions by a gate dielectric is arranged above a first surface of the semiconductor body. A length of an overlap between the source region and the gate electrode is larger than 70 nanometers. A doping profile of the low-resistance region along a line that is vertical to the first surface and goes through an edge of the gate electrode has a maximum of higher than 1E19 cm.

Latch-up resistant transistor device

A transistor device comprises at least one gate electrode, a gate runner connected to the at least one gate electrode and arranged on top of a semiconductor body, a plurality of gate pads arranged on top of the semiconductor body, and a plurality of resistor arrangements. Each gate pad is electrically connected to the gate runner via a respective one of the plurality of resistor arrangements, and each of the resistor arrangements has an electrical resistance, wherein the resistances of the plurality of resistor arrangements are different.

Transistor device with gate resistor

A transistor device includes drain, source and gate nodes, a plurality of drift and compensation cells each including a drift region of a first doping type and a compensation region of a second doping type complementary to the first doping type, and a control structure connected between the drift region of each of the drift and compensation cells and the source node. Each drift region is coupled to the drain node and each compensation region cells is coupled to the source node. A first type doping concentration Nof the drift region is higher than a first doping level L, and a second type doping concentration Nof the compensation region is higher than a second doping level L.

Transistor device with high avalanche robustness

A semiconductor device includes a semiconductor body, which includes transistor cells and a drift zone between a drain layer and the transistor cells. The drift zone includes a compensation structure. Above a depletion voltage a first output charge gradient obtained by increasing a drain-to-source voltage from the depletion voltage to a maximum drain-to-source voltage deviates by less than 5% from a second output charge gradient obtained by decreasing the drain-to-source voltage from the maximum drain-to-source voltage to the depletion voltage. At the depletion voltage the first output charge gradient exhibits a maximum curvature.

VDMOS having a drift zone with a compensation structure

Disclosed is a method for producing a transistor device and a transistor device. The method includes: forming a source region of a first doping type in a body region of a second doping type in a semiconductor body; and forming a low-resistance region of the second doping type adjoining the source region in the body region. Forming the source region includes implanting dopant particles of the first doping type using an implantation mask via a first surface of the semiconductor body into the body region. Implanting the doping particles of the first doping type includes a tilted implantation.

Latch-up resistant transistor

A field-effect transistor includes a semiconductor substrate, a source region formed in the semiconductor substrate, a drain region formed in the semiconductor substrate, a channel region formed in the semiconductor substrate, wherein the source region is connected to a source terminal electrode and the drain region is connected to a drain terminal electrode, wherein the channel region comprises a first narrow width channel region and a second narrow width channel region connected in parallel regarding the source terminal electrode and the drain terminal electrode, and wherein the first narrow width channel region and/or the second narrow width channel region comprise lateral edges narrowing the width of the narrow width channel region is such a way that a channel formation in the narrow width channel region is influenced by a mutually influencing effect of the lateral edges, and a gate electrode arranged above the first and second narrow width channel regions.

Field-effect transistor

A method is provided for manufacturing a buried strap contact between a transistor and a trench capacitor in a memory cell, particularly a DRAM memory cell. In this method, the two spacers of the gate electrode lying opposite one another and the gate path applied on the trench insulation of the memory cell serve as part of the mask that is employed for etching the contact trench and in which the buried bridge of the trench capacitor is subsequently generated. As a result, the position of that sidewall of the bridge facing toward the gate electrode is generated in self-aligning fashion relative to the gate electrode. This avoids photolithographic tolerances in the positioning of the bridge relative to the gate electrode.

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Munich, Germany

Bjoern Fischer