Semikron Elektronik Gmbh &co.kg

Björn Tauscher

Christian Kroneder

Harald Kobolla

Christian Göbl

Alexej Walter

Stefan Fries

A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.

Power semiconductor module with switching device and assembly

The present invention relates to a contact maker for the gate terminal of power semiconductor components in disc cells and power semiconductor modules. Disposed above the power semiconductor component is a shaped member that incorporates in the region of the gate terminal a recess, and this recess, in turn, also incorporates a counter-support. The contact maker consists of a contact spring incorporating a pin-like extension at the end of the spring that contacts the gate terminal, and incorporating a connection created via a shaped metal element to a connecting cable for the external connection at the other end of the spring, and of an insulating sleeve with a contact spring disposed therein. The insulating sleeve itself has at least one locking projection, which, together with the counter-support of the shaped member, forms a snap-lock connection.

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Munich, Georgia

Björn Tauscher