Imec Vzw

Imec

Bivragh Majeed

Chengxun Liu

Eric Beyne

Peter Peumans

Liesbet Lagae

Paolo Fiorini

Abdulkadir Yurt

Joeri De Vos

Philippe Soussan

Herman Oprins

Bart Vandevelde

A microfluidic routing device for routing objects of interest in a microfluidic flow includes a substrate; a first layer provided on the substrate, in which the first layer forms a bottom wall of a microfluidic channel. At least two holes through the first layer form respectively an inlet and an outlet for the microfluidic channel The microfluidic routing device further includes a second layer spaced away from the first layer, in which the second layer forms a top wall of the microfluidic channel. The second layer is configured to transmit an optical signal from the microfluidic channel. The microfluidic routing device includes an actuator for actuating the objects of interest in a sorting junction of the microfluidic channel.

Microfluidic routing

The present disclosure relates to microbubble generator devices for deflecting objects in a liquid, systems for sorting objects that utilize such devices, and methods for fabricating such devices. At least one embodiment relates to a micro-fluidic device for deflecting objects in a liquid. The device includes a substrate for providing an object-containing liquid thereon. The device also includes a microbubble generator that includes at least one microbubble generating element. The microbubble generator is located on a surface of the substrate and in direct contact with the object-containing liquid when the object-containing liquid is provided on the substrate. The at least one microbubble generating element is configured to deflect a single object in the object-containing liquid through generation of a plurality of microbubbles.

Microbubble generator device, systems and method to fabricate

Micro bump interconnection structures for semiconductor devices, and more specifically, a substrate structure comprising an array of micrometer scale copper pillar based structures or micro bumps eventually comprising a solder material and a method for manufacturing the same are provided.

Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same

The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels () which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes () or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet () of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

Device for cooling integrated circuits

Growing community of inventors

Leuven, Belgium

Bivragh Majeed