Applied Materials, Inc.

Applied Material, Inc.

Biraja Prasad Kanungo

Jennifer Y Sun

Vahid Firouzdor

Tom K Cho

Ying Di Zhang

Dmitry Lubomirsky

Yikai Chen

Vedapuram S Achutharaman

Ren-Guan Duan

David Koonce

Jared Ahmad Lee

Martin Jeffrey Salinas

Hamid Noorbakhsh

Senh Thach

Sumit Agarwal

Ying Zhang

Vahid Fioruzdor

Junhan Yuh

A method includes performing ion beam sputtering with ion assisted deposition to deposit a protective layer on a surface of a body. The protective layer is a plasma resistant rare earth-containing film of a thickness less than 1000 μm. The porosity of the protective layer is below 1%. The plasma resistant rare earth-containing film consists of 40 mol % to less than 100 mol % of YO, over 0 mol % to 60 mol % of ZrO, and 0 mol % to 9 mol % of AlO.

Ion beam sputtering with ion assisted deposition for coatings on chamber components

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

Chamber components with polished internal apertures

An article such as a susceptor includes a body of a thermally conductive material coated by a first protective layer and a second protective layer over a surface of the body. The first protective layer is a thermally conductive ceramic. The second protective layer covers the first protective layer and is a plasma resistant ceramic thin film that is resistant to cracking at temperatures of 650 degrees Celsius.

Plasma erosion resistant thin film coating for high temperature application

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 &#x3bc;in.

A chamber component for a process chamber comprises a ceramic body and one or more protective layer on at least one surface of the ceramic body, wherein the one or more protective layer comprises YAlOhaving a dielectric constant of 9.76+/&#x2212;up to 30% and a hermiticity of 4.4E-10 cm/s+/&#x2212;up to 30%.

Plasma erosion resistant rare-earth oxide based thin film coatings

A chamber component comprises a body and a plasma sprayed ceramic coating on the body. The plasma sprayed ceramic coating is applied using a method that includes feeding powder comprising a yttrium oxide containing solid solution into a plasma spraying system, wherein the powder comprises a majority of donut-shaped particles, each of the donut-shaped particles having a spherical body with indentations on opposite sides of the spherical body. The method further includes plasma spray coating the body to apply a ceramic coating onto the body, wherein the ceramic coating comprises the yttrium oxide containing solid solution, wherein the donut-shaped particles cause the ceramic coating to have an improved morphology and a decreased porosity as compared to powder particles of other shapes, wherein the improved surface morphology comprises a reduced amount of surface nodules.

Chemistry compatible coating material for advanced device on-wafer particle performance

An article includes a body having a plasma-sprayed ceramic coating on a surface thereof. The body can be formed of at one least one of the following materials: Al, AlO, AlN, YO, YSZ, or SiC. The plasma-sprayed ceramic coating can include at least one of YO, YAlO, YAlOor a solid-solution of YOmixed with at least one of ZrO, AlO, HfO, ErO, NdO, NbO, CeO, SmOor YbO. The plasma-sprayed ceramic coating can further include splats.

Plasma spray coating design using phase and stress control

An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 &#x3bc;m, wherein the plasma resistant rare earth oxide film is selected from a group consisting of an Er&#x2014;Y composition, an Er&#x2014;Al&#x2014;Y composition, an Er&#x2014;Y&#x2014;Zr composition, and an Er&#x2014;Al composition.

An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 &#x3bc;m, wherein the plasma resistant rare earth oxide film consists essentially of 40 mol % to less than 100 mol % of YO, over 0 mol % to 60 mol % of ZrO, and 0 mol % to 9 mol % of AlO.

An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 &#x3bc;m, wherein the plasma resistant rare earth oxide is selected from a group consisting of YF, ErAlO, ErAlO, and a ceramic compound comprising YAlOand a solid-solution of YO&#x2014;ZrO.

A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 &#x3bc;m over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.

Rare-earth oxide based coatings based on ion assisted deposition

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A heat treated ceramic article includes a ceramic substrate and a ceramic coating on the ceramic substrate. The ceramic coating is a non-sintered ceramic coating that has a different composition than the ceramic substrate. The heat treated ceramic article further includes a transition layer between the ceramic substrate and the ceramic coating, the transition layer comprising first elements from the ceramic coating that have reacted with second elements from the ceramic substrate, wherein the transition layer has a thickness of about 0.1 microns to about 5 microns.

Heat treated ceramic substrate having ceramic coating

An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of YAlO, ErO, ErAlO, and a ceramic compound comprising YAlOand a solid-solution of YO&#x2014;ZrO.

An article comprises a plasma resistant ceramic material comprising YOat a concentration of approximately 30 molar % to approximately 60 molar %, ErOat a concentration of above 30 molar % to approximately 60 molar %, and at least one of ZrO, GdOor SiOat a concentration of over 0 molar % to approximately 30 molar %.

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San Jose, CA, United States of America

Biraja Prasad Kanungo