Praxair Technology, Inc.

Praxair S.t. Technology, Inc.

Binu Mathew

Paul S Gilman

Thomas J Hunt

Holger J Koenigsmann

Andrew C Perry

Wendell R Stuber

Peter McDonald

Brian J O'Hara

Brian J O'HARA

The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.

Method for forming sputter target assemblies having a controlled solder thickness

A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 &#x3bc;m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver an gold sputter targets.

Controlled-grain-precious metal sputter targets

A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 &#x3bc;m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver and gold sputter targets.

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Spring Valley, NY, United States of America

Binu Mathew