Fujifilm Electronic Materials U.s.a., Inc.

Arch Specialty Chemicals, Inc.

Other

Binod B De

Sanjay Malik

William A Reinerth

Ognian N Dimov

Raj Sakamuri

Ahmad A Naiini

Stephanie J Dilocker

Patrick Foster

Gregory Domenic Spaziano

Andrew J Blakeney

John Joseph Biafore

Thomas Steinhausler

Sidney George Slater

Joseph J Schwab

Yi-Zhong An

Ashok Reddy

Chisun Hong

J Thomas Kocab

Thomas Sarubbi

This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

Dielectric film-forming composition

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

Polyimides

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Photosensitive polyimide compositions

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.

Photosensitive stacked structure

A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),  

Polyimide compositions

This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.

Cleaning composition

This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.

Polymer and thermosetting composition containing same

This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.

Dielectric film forming composition

This disclosure relates to a process of purifying a polymer. The process includes (a) providing an organic solution containing a polyimide or polyamic ester in at least one polar, aprotic polymerization solvent; (b) adding at least one purification solvent to the organic solution to form a diluted organic solution, the at least one purification solvent is less polar than the at least one polymerization solvent and has a lower water solubility than the at least one polymerization solvent at 25&#xb0; C.; (c) washing the diluted organic solution with water or an aqueous solution to obtain a washed organic solution; and (d) removing at least a portion of the at least one purification solvent in the washed organic solution to obtain a solution containing a purified polyimide or polyamic ester. This disclosure also relates to a process of preparing a film on a semiconductor substrate, as well as related purified polymer solutions, films, and articles.

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Attleboro, MA, United States of America

Binod B De