Dow Global Technolgoies LLC

Rohm & Haas Electronic Materials LLC

Binghe Gu

Paul Joseph Popa

Garo Khanarian

Weijun Zhou

Allen S Bulick

John W Lyons

John Ell

A curable liquid polysiloxane/TiOcomposite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiOdomains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiOcomposite contains 20 to 60 mol % TiO(based on total solids); wherein the curable liquid polysiloxane/TiOcomposite exhibits a refractive index of &#x3e;1.61 to 1.7 and wherein the curable liquid polysiloxane/TiOcomposite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Curable liquid composite light emitting diode encapsulant

A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiOcomposite, which exhibits a refractive index of &#x3e;1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiOcomposite; and, curing the curable liquid polysiloxane/TiOcomposite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.

Light emitting diode manufacturing method

Growing community of inventors

Midland, MI, United States of America

Binghe Gu